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Exposure device and positioning method

A technology for exposure devices and exposure objects, which is applied in the direction of using optical devices, measuring devices, optics, etc., and can solve problems such as insufficient positioning accuracy of photomasks and substrates

Active Publication Date: 2005-09-28
ADTEC ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, sometimes the printed circuit board and the photomask are stretched or deformed due to temperature, humidity, and other process factors, and the positioning accuracy of the photomask and the substrate using the above-mentioned center of gravity is not enough.

Method used

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  • Exposure device and positioning method
  • Exposure device and positioning method

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0017] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0018] figure 1 It represents an exposure device for manufacturing a printed circuit board. The printed circuit board W coated with photoresist is placed on the table 3 and can be moved in the XYZ and θ directions by the moving mechanism 2 .

[0019] The photomask M drawn with the circuit pattern is arranged opposite to the substrate W, so that the photomask M and the substrate W are close to or close to each other, and the printed circuit pattern is photosensitive on the substrate W by exposure of the exposure light source 5 .

[0020] In addition, in figure 1 In the present invention, the substrate W and the photomask M are arranged vertically, but the present invention is not limited thereto, and may be reversed, or a structure in which the substrate W and the photomask M are arranged vertically.

[0021] In addition, instead of moving the stage 3, the...

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PUM

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Abstract

This invention provided an exposing device in which optimum positioning can be performed. Primary positioning is carried out first (S1), deviation Dp between a substrate mark 10 and a mask mark 20 are detected at P1, P2, P3, and P4 (S2), and a maximum value MPd among them is stored (S3). The above processing is repeated N times (S4) to detect N maximum values MDp and a minimum value MDpmin among them is found (S5). It is discriminated whether MDpmin < a specified value (S6) and when so, it is judged that the position of (n)th positioning where the minimum value MDpmin is detected is an optimum position (S7). When not, it is judged that the substrate is a defective (S8).

Description

technical field [0001] The invention relates to an exposure device and a positioning method. Background technique [0002] In recent years, with the miniaturization and refinement of printed circuit boards, printed circuit boards are also manufactured by photolithography, which uses exposure equipment to form circuits on substrates, the same as semiconductor manufacturing. That is, on the surface of the substrate coated with a photosensitive material such as photoresist, it is exposed to an exposure device to form a predetermined pattern, and then the pattern is formed on the substrate through an etching process to manufacture a printed circuit board. [0003] In this exposure device, a photomask such as a resin film or resin glass is used as an original plate for drawing an original pattern, and the positioning of the photomask and the substrate is very important for obtaining a high-precision product during exposure. [0004] Therefore, in general, marks for positioning a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/00G03F7/00G03F9/00H05K3/00
CPCG03F7/706G03F7/70691G03F7/70775G03F7/7085G03F9/7023G03F9/7084
Inventor 桥本一范
Owner ADTEC ENG