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Microelectromechanical device with integrated conductive shield

A micro-electromechanical, conductive shielding technology, used in micro-structure devices, generators/motors, manufacturing micro-structure devices, etc., can solve problems such as drift and instability

Inactive Publication Date: 2005-09-28
HONEYWELL INT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Environmental conditions that act on or affect MEMS devices that are susceptible to environmental influences can cause undesired effects that may prevent the device from achieving an acceptable level of performance
These environmental conditions, which often contain energy in one form or another, may have undesired effects on the electrical output of the device, such as drift or instability

Method used

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  • Microelectromechanical device with integrated conductive shield
  • Microelectromechanical device with integrated conductive shield
  • Microelectromechanical device with integrated conductive shield

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Embodiment Construction

[0017] Embodiments of microelectromechanical devices described herein relate to preferred microelectromechanical pressure sensors and structural components thereof. The structures and methods described for fabricating microelectromechanical pressure sensors are equally applicable to other microelectromechanical devices.

[0018] figure 1 is a conceptual diagram showing one embodiment of a side section of the structure of the MEMS device 100 at the first stage of processing. although figure 1 and other figures that follow show the substrate of the microelectromechanical device at certain stages of processing, but these stages are for illustration only and do not necessarily limit the scope of the preferred embodiment, provide sequential processing steps, or provide invariable manufacturing method.

[0019] see figure 1 The MEMS device 100 includes a substrate 102, a silicon substrate layer 102a, a buried oxide layer 104, and a top epitaxial layer 106 disposed on the top sur...

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PUM

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Abstract

A microelectromechanical device and method of fabricating the same, including a layer of patterned and deposited metal or mechanical-quality, doped polysilicon inserted between the appropriate device element layers, which provides a conductive layer to prevent the microelectrochemical device's output from drifting. The conductive layer may encapsulate of the device's sensing or active elements, or may selectively cover only certain of the device's elements. Further, coupling the metal or mechanical-quality, doped polysilicon to the same voltage source as the device's substrate contact may place the conductive layer at the voltage of the substrate, which may function as a Faraday Shield, attracting undesired, migrating ions from interfering with the output of the device.

Description

technical field [0001] The present invention relates to an integrated micro-electromechanical device, in particular to a semiconductor micro-electromechanical device with an integrated conductive shield and a manufacturing method thereof. Background technique [0002] Microelectromechanical devices are used in many fields of application. These devices range from automotive sensors to actuators used on space exploration vehicles. Typically, these sensors and actuators provide information about and / or respond to changes in environmental conditions. For example, a microelectromechanical pressure sensor device can be used to measure automobile engine manifold pressure (or vacuum). In operation, the microelectromechanical pressure sensor device provides an electrical output proportional to manifold pressure (or vacuum). An engine management system can use this electrical output to control the fuel delivered to the car's engine. [0003] In another practical application, one o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00G01L9/00G01L19/06
CPCG01L9/0042G01L19/0627
Inventor T·G·斯特拉顿C·H·拉恩G·R·加纳
Owner HONEYWELL INT INC