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Electronic module having canopy-type carriers

An electronic module and carrier technology, applied in circuits, printed circuits, circuit devices, etc., can solve problems such as high cost and increased chip density

Inactive Publication Date: 2010-06-16
LEGACY ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] As can be seen from the above examples, the increase in chip density can be obtained through complex packaging and stacked structures, which will inevitably lead to a higher cost per bit of storage

Method used

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  • Electronic module having canopy-type carriers
  • Electronic module having canopy-type carriers
  • Electronic module having canopy-type carriers

Examples

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Embodiment Construction

[0040] As is clear from the attached figures, the invention proposes the manufacture of electronic modules with increased circuit density. The present invention can be used in a variety of applications. One very obvious use is in the manufacture of modules for memory. Since modules of memory are generally integrated into printed circuit boards of strictly specified dimensions, more efficient use of the real state of the motherboard will result in modules with greater total memory capacity. The invention can also be applied to related but not identical IC packages that are more closely coupled. For example, an IC package containing cache memory may be required to be mounted on top of an IC package containing a microprocessor chip. Various embodiments of improved electronic modules will now be discussed in detail with reference to the accompanying drawings.

[0041] now refer to figure 1 and figure 2 , the package carrier 100 of the first embodiment has a dielectric body 1...

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Abstract

An improved multi-chip module includes a main circuit board having and array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of the package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface,by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A number of other vriations exist that provide various other embodiments of the invention including one in which the carrier leads are laminated directly to the leads of an IC package.

Description

field of invention [0001] The present invention relates to the production of multi-chip electronic modules, and more particularly, to methods and apparatus for packaging multi-chip integrated circuits on printed circuit boards. It also relates to high-density memory modules with three-dimensional integrated circuit packaging structures. Background of the invention [0002] The demand for semiconductor memory tends to have high plasticity. On the one hand, when such memory is not prohibitively expensive compared to the overall cost of the computer system, the near-unsellable demand makes computer manufacturers tend to install large amounts of main memory in each system, far in excess of the average program Use desired amount. On the other hand, when the cost is high, the manufacturer generally installs in each system only the amount needed to satisfy the average program. Although the selling price of the computer can be maintained at a low level, the end user will immediat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/14H01L25/18H01L25/11H01L25/10H05K3/36H05K3/34
CPCH05K2201/1034H05K3/0061H05K2201/10924H01L25/105H05K2201/10515H05K3/3405H05K2201/10734H01L2225/1005H01L2924/0002H01L2225/1094H05K3/368H05K2201/049H05K1/0231H05K2201/10659H05K1/141H01L2225/107H05K2201/10689H05K3/3421H01L2225/1029H01L2924/00H01L25/10
Inventor K·J·克莱德齐克J·C·恩格尔
Owner LEGACY ELECTRONICS INC