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A condenser microphone mountable on main PCB

A technology of capacitive microphones and backplanes, which is applied in the direction of electrostatic transducer microphones, microphone ports/microphone accessories, printed circuits connected with non-printed electrical components, etc., which can solve the problem that the main PCB installation area is directed to the inside , poor sound quality, etc.

Inactive Publication Date: 2011-08-24
BSE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in conventional condenser microphones, it is difficult to direct the component mounting area of ​​the main PCB to the inside
That is, when the component mounting area of ​​the main PCB is directed inward, the sound quality of conventional condenser microphones is poor because the sound wave conduction path is separated from the sound source

Method used

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  • A condenser microphone mountable on main PCB
  • A condenser microphone mountable on main PCB
  • A condenser microphone mountable on main PCB

Examples

Experimental program
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Effect test

no. 1 example

[0027] Figure 6 To represent a side sectional view of a first preferred embodiment of a condenser microphone according to the present invention, and Figure 7 is an exploded perspective view showing the first preferred embodiment of the condenser microphone according to the present invention.

[0028] refer to Figure 6 and Figure 7 , the condenser microphone of the present invention includes: a cylindrical housing 402, one side of which is open and the other side is closed; a first metal ring 406, which is inserted into the housing 402 to be electrically connected to a back plate 408; a disc-shaped back plate 408, which has a sound hole 408a; a thin annular spacer 410; a cylindrical insulating ring 414, which has an open top and an open bottom, to provide electrical insulation functions as well as mechanical support functions; a diaphragm element 412, which is inserted into said insulating ring 414 , and facing the back plate 408, while inserting the gasket 410 between t...

no. 2 example

[0035] Figure 8 To represent a side sectional view of a second preferred embodiment of the condenser microphone according to the present invention, and Figure 9 is an exploded perspective view showing a second preferred embodiment of the condenser microphone according to the present invention.

[0036] refer to Figure 8 and Figure 9 , the condenser microphone 500 of the present invention includes: a cylindrical housing 502, which is open on one side and closed on the other side; a first metal ring 506 inserted into the housing 502 to be electrically connected to a back plate 508; a disc-shaped back plate 508, which has a sound hole 508a; a thin annular spacer 510; a cylindrical insulating ring 514, which has uneven portions 514a, 514b, and an open top and an open bottom to provide electrical insulation and mechanical support functions; diaphragm element 512, It is inserted into the insulating ring 514 and faces the back plate 508, while inserting the spacer 510 between ...

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PUM

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Abstract

A condenser microphone mountable on a main PCB is disclosed. The condenser microphone of the present invention comprises a cylinder-shaped case having one side which is opened and the other side which is closed; a first metal ring inserted into the case for an electrical connection; a disk-shaped back plate having a sound hole to be connected electrically to the case through the first metal ring;a ring-shaped spacer; a cylinder-shaped insulating ring having an open top part and an open bottom part to provide an electrical insulation and a mechanical support; a diaphragm inserted into the insulating ring and facing to the back plate while interposing the spacer between the diaphragm and the back plate; a second metal ring for being connected electrically to the diaphragm and supporting mechanically the diaphragm; and a PCB that is mounted with electronic components and is formed with a sound hole, the PCB being connected to the back plate through the second metal ring and the case, the PCB including connection terminals connected to the outside. Accordingly, the condenser microphone maintains the sound quality in a good state since the sound wave transfer path is short even if thecomponent mount region of the main PCB on which the condenser microphone is mounted is directed toward an inner side of the electronic product at need.

Description

technical field [0001] The present invention relates to a condenser microphone, and more particularly to a condenser microphone mountable on a main PCB (Printed Circuit Board). Background technique [0002] Since consumers prefer miniaturized electronic products and high-performance electronic products, in order to meet the needs of consumers, manufacturers usually focus on the miniaturization of electronic products. In general, SMT (Surface Mount Technology) is commonly used to miniaturize electronic products. However, since the reflow process of SMD (Surface Mount Device) is performed at high temperature, SMT is not used for electronic components having a lower critical temperature. [0003] Also, since electronic components have a predetermined thickness even if SMT is employed therefor, when the main PCB is mounted in the electronic product, the component mounting area of ​​the main PCB must be directed toward the inner side of the electronic product. [0004] At the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R1/06H05K1/18
CPCH04R19/04H05K2201/09072H05K1/181H05K2201/10083H04R1/06Y02P70/50H04R1/08H05K2203/0455
Inventor 宋清淡郑益周金贤浩朴成镐林俊
Owner BSE CO LTD