Modular integrated circuit and producing method thereof

Abstract

The present invention is modular integrated circuit and its making process. The making process includes: forming one functional module with at least one functional assembly on one functional substrate in the first wafer making site; forming the conducting layer module with at least one conducting layer on the conducting layer substrate in the second wafer making site; and jointing the functional module and the conducting layer module and electrically connecting at least one functional assembly in the functional module with the conducting layer of the conducting layer module to form one integrated circuit. The making process has short making time, low cost, less risk and high product quality. In addition, the modular integrated circuit may have the jointed substrate utilized for packing and this results in saving in time and cost.

Description

technical field [0001] The present invention relates to a modular integrated circuit and its manufacturing method, especially to a kind of integrated circuit that can be divided into several modules, and the several modules can be selected to be manufactured at different places at the same time, and then by bonding technology The modular integrated circuit and its manufacturing method can save the time and cost of manufacturing integrated circuits, reduce manufacturing risks and improve the yield of manufacturing. The modular integrated circuit in this case can also use the bonded module substrate to achieve the purpose of integrated circuit chip packaging, which can save the additional time and cost required for the manufacture of integrated circuit packaging. Background technique [0002] In recent years, due to the high development of the information electronics industry and people's psychology of seeking new and changing new products, relevant integrated circuit design a...

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Problems solved by technology

[0009] In view of the above-mentioned shortcomings of conventional integrated circuit manufacturing methods, the object of the present invention is to provide a modular integrated circuit wafer manufacturing method, which is to divide the integrated circuit into several modules, which can be selected to be manufactured at different places at the same time, and then bonded Technology bonding, to save the time and cost of manufacturing integrated circuits and improve the problem of poor flatness in the above-mentioned wafer manufacturing process, and improve the production and production yield of modular integrated circuits and their manufacturing methods

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