Manufacturing method and application of high-flatness PCB

Abstract

The invention discloses a manufacturing method and application of a high-flatness PCB, and relates to the technical field of PCB preparation. The method comprises steps: using a whole non-windowed high-fluidity PP sheet as an insulating layer of an outer circuit; pressing the PP sheet by using a steel plate-to-steel plate pressing mode through a pressure transmission machine, and covering the surface of the PP sheet with a whole pure copper foil; etching off the pure copper foil on the surface of the PP sheet through an etching method; and using a CO2 laser drilling machine to ablate and remove the PP sheet corresponding to the required bonding pad windowing area, and exposing the bonding pad. According to the invention, the problem of poor flatness of a conventional PCB solder resist process can be greatly improved, the problem of insufficient flatness of a high-end PCB product can be greatly improved, and the process requirement that the surface flatness of the PCB product is less than 10 microns is met.

Description

technical field [0001] The disclosure of the present invention relates to the technical field of PCB board preparation, in particular to a method for manufacturing a high-flatness PCB board and its application. Background technique [0002] The outer layer of the conventional PCB board generally uses solder mask as the surface insulation layer. Printing liquid solder mask ink cannot completely fill the depressions between the lines, and the thickness of the solder mask film will be uneven during printing, resulting in unqualified flatness; When the soldering process is applied to products with high flatness requirements such as IC substrates / camera PCB boards, it is already difficult to meet the process requirements for flatness <30um. [0003] The difficulty in solving the above technical problems lies in that when the traditional liquid solder mask is used as the insulating layer on the circuit surface, due to the insufficient fluidity of the solder mask ink and the inf...

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Problems solved by technology

[0002] The outer layer of the conventional PCB board generally uses solder mask as the surface insulation layer. Printing liquid solder mask ink cannot completely fill the depressions between the lines, and the thickness of the solder mask film will be uneven during printing, resulting in unqualified flatness; When the soldering process is applied to products with high flatness requirements such as IC substrates / camera PCB boards, it is difficult to meet the process requirements for flatness <30um

[0003] The difficulty in solving the above technical problems lies in: when the traditional liquid solder mask is used as the insulating layer on the surface of the circuit, due to the insufficient fluidity of the solder mask ink and the influence of the surface tension of the ink, it is difficult for the flatness of the solder mask layer to meet the requirement of <30um

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