Unlock instant, AI-driven research and patent intelligence for your innovation.

System and method for storing and accessing information, method for internal knowledge updating, information access system

A technology of access system and access method, which is applied in the field of conceptual information acquisition and information configuration, and can solve problems such as particle pollution, discovery, and process integration

Inactive Publication Date: 2006-01-04
TAIWAN SEMICON MFG CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many problems of unknown origin in the advanced semiconductor manufacturing environment, and extensive testing is required to find and solve these problems
These issues may be due to process integration or particle contamination
Traditional keyword search or data comparison methods are usually unable to find the most relevant information from the database

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System and method for storing and accessing information, method for internal knowledge updating, information access system
  • System and method for storing and accessing information, method for internal knowledge updating, information access system
  • System and method for storing and accessing information, method for internal knowledge updating, information access system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] It must be noted here that the different embodiments or examples presented in the following disclosure are used to illustrate different technical features disclosed in the present invention, and the specific examples or arrangements described are used to simplify the present invention. It is not intended to limit the invention. In addition, the same reference numerals and symbols may be used repeatedly in different embodiments or examples, and these repeated reference numerals and symbols are used to describe the content disclosed in the present invention, rather than to represent differences between different embodiments or examples. Relationship.

[0029] refer to figure 1 , which represents the system of the first embodiment of the present invention, which is used for storing or extracting information and providing relationships between different information groups. System 100 includes a virtual IC manufacturing system 102 ("virtual cleanroom 102"). System 100 als...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an information access method and a system thereof, an internal knowledge tree updating method and an information extraction system and concretely relates to a computer system and a processing method used for memorizing and accessing information. The system comprises an internal intelligent type agent, the internal knowledge tree which is connected with a first internal intelligent type agent and an external data source. The internal intelligent type agent inquires upon the internal knowledge tree before accessing the external data source to provide information.

Description

technical field [0001] The present invention relates to a semiconductor manufacturing technology, in particular to a system and method for conceptual information acquisition and information configuration. Background technique [0002] The semiconductor integrated circuit (Integrated Circuit, hereinafter referred to as IC) industry is experiencing rapid growth. Technological advances in IC materials and designs have created different IC eras, each with smaller and more complex circuits than the previous era. However, these advances will increase the complexity of IC manufacturing and processing, so further development of related IC manufacturing and processing technologies is required in practice. For example, when manufacturing an IC using a certain process step to make one or more components (such as circuit components) on the substrate, when the geometry of the component shrinks, the active device density (that is, the unit IC area) on the IC The number of components on ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/00G06F17/30G06F7/00G06N5/02
CPCG06N5/02
Inventor 刘贞维杜维武陈君仪李月青
Owner TAIWAN SEMICON MFG CO LTD