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Reduced splattering of unpassivated laser fuses

A laser and fusing technology, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of non-passivated fuse short circuit, fuse material splashing, etc., to reduce the overall manufacturing time and cost, easy modified effect

Inactive Publication Date: 2006-01-18
INT BUSINESS MASCH CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, without a passivation layer, the fuse blowing process suffers from the fact that the molten fuse material may evaporate without sufficient heat, which prevents the entirety of the molten metal from evaporating
Partial evaporation of molten metal may result in splashing of fuse material which remains in liquid form
Splashed fuse material may cause an electrical short to a non-passivated fuse adjacent to the blowing fuse

Method used

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  • Reduced splattering of unpassivated laser fuses
  • Reduced splattering of unpassivated laser fuses
  • Reduced splattering of unpassivated laser fuses

Examples

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Embodiment Construction

[0026] The making and using of various embodiments are described in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in many specific contexts. The specific embodiments described herein are intended merely to illustrate individual ways to make and use the invention, and are not intended to limit the scope of the invention.

[0027] Turning now to FIG. 1 , this figure illustrates a top view of a non-passivated laser fuse 100 on a hard dielectric layer 115 . The hard dielectric layer is on top of a substrate 116 (not shown in Figure Ia, but present in cross-section later on). As mentioned earlier, a non-passivated laser fuse differs from a passivated laser fuse in that it lacks a passivation layer to protect it from the environment. A non-passivated laser fuse requires less laser energy to blow than a passivated laser fuse. This is because the laser does not have to first penetrate the...

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PUM

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Abstract

The act of blowing an unpassivated electrical fuse (for example, fuse 405) using a laser can result in the splattering of the fuse material and result in electrical short circuits. A blast barrier (for example blast barrier 406) formed around an area of the fuse that is blown by the laser helps to contain the splattering of the fuse material. The blast barrier may be formed from the same material as the fuses themselves and therefore, can be created in the same fabrication step.

Description

technical field [0001] The present invention relates generally to the fabrication of integrated circuits, and more particularly to preventing spattering of fuse material from creating short circuits in other laser fuses when non-passivated laser fuses are blown. Background technique [0002] In the manufacture of integrated circuits, laser fuses have been used for a long time. One application of laser fuses is to activate or deactivate specific functions in an integrated circuit, depending on the intended use of the integrated circuit. For example, an integrated circuit can be single designed to have a complete set of functions. However, depending on the price at which the integrated circuit is sold, certain functions may be disabled. In another application, laser fuses allow defective devices and circuits in integrated circuits to be replaced with functioning spares and circuits. Typically, when an integrated circuit is tested to verify its operational performance, the t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/71H01L23/525
CPCH01L23/5258H01L2924/0002H01L2924/00H01L27/02
Inventor 杰拉尔德·R.·弗利斯安迪·考利莫哈梅德·F.·法亚兹威廉·T.·莫特斯弗
Owner INT BUSINESS MASCH CORP
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