High-frequency power amplifier
A technology for power amplifiers and power amplification, which is applied to high-frequency amplifiers, amplifier combinations, amplifier protection circuit layout, etc., can solve problems such as high-frequency power amplifier burnout, abnormal oscillation, and device damage, and achieve high-performance operation and maintenance The effect of high-performance work and high reliability
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Embodiment approach 1
[0044] Hereinafter, a high-frequency power amplifier according to Embodiment 1 of the present invention will be described.
[0045] figure 1 It is an equivalent circuit diagram showing a configuration example of the high-frequency power amplifier of the first embodiment. Such as figure 1 As shown, the high-frequency power amplifier of the first embodiment has a one-stage configuration of the amplifying transistor 1 and uses a field effect transistor as the amplifying transistor 1 . The amplification transistor 1 is a multi-unit structure in which four unit cells 2, 3, 4, and 5 are connected in parallel, and the gate terminals 6, 7, 8, and 9 of the unit cells 2, 3, 4, and 5 are respectively connected to diodes 10, 11, and 12. , 13.
[0046] The directions of the diodes 10, 11, 12, 13 are connected in the same direction with respect to the gate terminals 6, 7, 8, 9 of the unit cells 2, 3, 4, 5. The other ends of the diodes 10 , 11 , 12 , and 13 connecting the unit cells 2 ...
Embodiment approach 2
[0050] Hereinafter, a high-frequency power amplifier according to Embodiment 2 of the present invention will be described.
[0051] figure 2 It is a specific configuration diagram showing an example configuration of a high-frequency power amplifier according to the second embodiment. Such as figure 2 As shown, the high-frequency power amplifier according to Embodiment 2 has a one-stage configuration of amplifying transistors, and bipolar transistors are used as amplifying transistors. The amplifier transistor chip 34 has a multi-unit configuration in which four unit cells 35 , 36 , 37 , and 38 are connected in parallel, and is bonded to a bare die pad region 40 formed of printed metal wiring on a dielectric substrate 39 . The base terminals 41 , 42 , 43 , 44 of the unit cells 35 , 36 , 37 , 38 are respectively connected to diodes 45 , 46 , 47 , 48 .
[0052] The directions of the diodes 45, 46, 47, 48 are all connected in the same direction with respect to the base termin...
Embodiment approach 3
[0056] Hereinafter, a high-frequency power amplifier according to Embodiment 3 of the present invention will be described.
[0057] image 3 It is an equivalent circuit diagram showing a configuration example of the high-frequency power amplifier of the third embodiment. Such as image 3 As shown, the high-frequency power amplifier according to Embodiment 3 has a one-stage configuration of the amplifying transistor 74 , and field effect transistors are used as unit cells constituting the amplifying transistor 74 . The amplification transistor 74 is composed of four unit cells 75, 76, 77, 78 connected in parallel, and the gate terminals 78, 79, 80, 81 of the unit cells 75, 76, 77, 78 are connected to the respective field effect transistors 83, 84 , 85, 86 drain terminals. Source terminals of field effect transistors 83, 84, 85, 86 are connected to resistors 87, 88, 89, 90 respectively, and the other ends of resistors 87, 88, 89, 90 are grounded. The gate terminals of the fi...
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