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Semiconductor die package with reduced inductance and reduced die attach flow out

A semiconductor and electrical connection technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problem of limited shortening of welding lead length, etc., and achieve package size reduction, inductance reduction, and welding lead length The effect of shortening

Active Publication Date: 2006-03-15
SKYWORKS SOLUTIONS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to various factors, the amount of reduction in solder lead length is very limited

Method used

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  • Semiconductor die package with reduced inductance and reduced die attach flow out
  • Semiconductor die package with reduced inductance and reduced die attach flow out
  • Semiconductor die package with reduced inductance and reduced die attach flow out

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Embodiment Construction

[0017] The present invention is directed to a semiconductor chip package with reduced inductance and reduced spillage of die attach adhesive. The following description contains specific information for practicing the invention. Those skilled in the art will recognize that the present invention may be practiced otherwise than as specifically discussed in this application. Furthermore, some of the specific details of the invention have not been discussed in order not to obscure the invention. Specific details not described in this application are known to those of ordinary skill in the art.

[0018] The drawings in this application and their associated detailed description are intended to be only representative embodiments of the invention. In the interest of maintaining brevity, other embodiments of the invention that utilize the principles of the invention are not specifically described in this application, nor are they specifically shown in the present drawings. It should ...

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Abstract

In one exemplary embodiment, a structure comprises a substrate having a top surface, and a die attach pad situated on the top surface of the substrate. The die attach pad includes a die attach region and at least one substrate ground pad region electrically connected to the die attach region. The die attach pad further includes a die attach stop between the die attach region and the at least one substrate ground pad region. The die attach stop acts to control and limit die attach adhesive flow out to the at least one substrate ground pad region during packaging so that the at least one substrate ground pad region can be moved closer to die attach region so that shorter bond wires for connecting the at least one substrate ground pad region to a die wire bond pad may be used during packaging.

Description

technical field [0001] The present invention generally relates to the field of semiconductors. More specifically, the present invention relates to the field of semiconductor packaging. Background technique [0002] During the semiconductor packaging process, chips are mounted on chip connection pads fabricated on the surface of the substrate. The die is typically attached to the die attach pads using a die adhesive. Epoxy, for example, is a common die attach adhesive used for this purpose. Such epoxies may be referred to as "die attach epoxies". After the chip is mounted on the substrate, the chip lead bonding pads on the chip are electrically connected to their corresponding substrate ground pads and substrate signal pads on the substrate using bonding wires. [0003] In general, it is desirable to shorten the length of the bond wires used to connect the chip lead bond pads to the substrate ground and substrate signal pads. A significant advantage is, for example, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/498H01L23/50
CPCH01L2924/01015H01L2924/01082H01L23/50H01L2924/01004H01L2224/27013H01L2924/15311H01L2924/01029H01L2924/01028H01L2224/48091H01L23/49838H01L2924/30107H01L24/32H01L24/49H01L2224/32225H01L2224/48237H01L2924/01047H01L2224/85385H01L24/48H01L2924/01079H01L2224/83385H01L2224/48227H01L2924/01033H01L2924/01005H01L2924/01006H01L2924/01078H01L2224/73265H01L2224/83051H01L2224/49H01L2224/26175H01L2924/00014H01L24/73H01L2924/00012H01L2924/00H01L2224/45099H01L23/12H01L23/48
Inventor S·L·佩蒂-威克斯P·L·威尔驰
Owner SKYWORKS SOLUTIONS INC
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