Supercharge Your Innovation With Domain-Expert AI Agents!

Copper based precipitation hardening alloy

A precipitation hardening and alloying technology, which is applied in the field of copper-based precipitation hardenable alloys, can solve the problems of poor copper conductivity and copper softness, and achieve the effect of improving conductivity and mechanical properties

Inactive Publication Date: 2006-07-19
OUTOKUMPU COPPER PROD
View PDF2 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also high purity copper is too soft for applications requiring high strength mechanical properties and annealing resistance
Direct alloying of copper has considerable drawbacks, as direct alloying leads to poor electrical conductivity of copper

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper based precipitation hardening alloy
  • Copper based precipitation hardening alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The addition of phosphorus up to 500 ppm to Cu-based precipitation hardenable alloys containing Cr, Zr and Ti has a direct effect on the electrical conductivity of the alloy. The addition of P can reduce the solubility of alloying elements Cr, Zr or Ti in the final crystal structure of face centered cubic Cu. For example Cr forms thermally stable phosphides such as Cr 3 P and CrP 4 , but does not form complex phosphides with copper. One reason is that the final crystal structure of Cr is body centered cubic (bcc) instead of face centered cubic (fcc) of Cu.

[0014] In the presence of P, the solubility of Cr in Cu is as figure 1 As shown, it is referenced from Villars P., Prince A., Okamoto H., Ternary Alloy Phase Diagrams Handbook (Thernary Alloy Phase Diagrams), Vol7&8, AsM International, Metals Park (OH), 1998. figure 1 Indicates the additive Cu-Cr-P ternary alloy at 600 °C near the copper endpoint, "additive" means that the ternary interaction is neglected, and t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a copper based precipitation hardenable alloy containing at least one of the elements chromium, zirconium or titanium, wherein the copper based precipitation hardenable alloy is alloyed by phosphorus.

Description

technical field [0001] The present invention relates to at least one copper-based precipitation-hardenable alloy having improved high-strength mechanical properties and annealing resistance. Background technique [0002] Japanese Patent Publication JP06-212374 discloses a method for preparing a copper-based precipitation-hardenable alloy that can be used as a material for small electrical and electronic components. The alloy contains: by weight percentage, Ni 2-4%, Si 0.5-1.0%, Zn 0.1-1.0%, Al 0.001-0.15%, Mn 0.01-0.1%, Cr 0.001-0.1%. Due to the presence of multiple alloying elements, the production cost of the alloy is higher than that of alloys containing fewer alloying elements. [0003] The copper-based precipitation-hardenable alloy disclosed in British Patent GB609900 contains by weight percentage: Cr 0.25-1.5%, the content of deoxidizer Zn, B, Na, Li and P is not more than 0.2% and strengthening elements Ni, Fe or The content of Co is 0.1-5.0%. The electrical condu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00
CPCC22C9/00
Inventor R·尼泊特B·斯万克M·吉塔
Owner OUTOKUMPU COPPER PROD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com