Orientation equipment

A technology for positioning devices and substrates, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc. It can solve problems such as floating substrates, uneven temperature, and damaged substrates, and achieve the effect of preventing uneven temperature
CN1812073AActive Publication Date: 2006-08-02TOKYO OHKA KOGYO CO LTD +1
2 Cites 6 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
TOKYO OHKA KOGYO CO LTD
Publication Date
2006-08-02

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The present invention provides a positioning device which can accurately position a substrate without damaging it even if the substrate is made large. In a state where a slide member 6 is retreated, a cylinder unit 2 is operated to raise a supporting member 3, and a substrate W is received by the upper surface of the reception part 11 of a lifting member 8. Next, the cylinder unit 2 is operated to lower the supporting member 3 until the substrate W is on the same level of the slide member 6 of an alignment member 5, and a valve is changed over to connect the piping 12 of the lifting member 8 to a compressed air source. An air is allowed to be jetted from grooves 16 and 17 on the upper surface of the reception part 11 of the lifting member 8, so as to lift the substrate W from the upper surface of the reception part 11, move forward the slide member 6 of the alignment member 5, and bring a pusher 7 into contact with the edge of the substrate W for positioning.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a positioning device suitable for a standby unit or the like arranged in front of a substrate processing apparatus. Background technique

[0002] Devices disclosed in Patent Document 1 and Patent Document 2 are known as devices for positioning substrates such as semiconductor wafers and glass substrates in a floating state.

[0003] In the device disclosed in Patent Document 1, air is jetted from an air jet opening opened on the stage to float the wafer, and in this state, the wafer is pushed by the air from the air nozzle disposed on one side. Positioning is performed on the reference member provided at the place opposite to the air nozzle. In the device disclosed in Patent Document 2, a suction pad is provided at the corner or the periphery of the frame-shaped workbench, the suction pad is added with an air ejection function, and the photomask (substrate) is blown by the air ejected from the suction pad. ) to float ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More