Solid-state imaging device
A solid-state imaging device and solid-state image technology, applied in radiation control devices, semiconductor/solid-state device components, image communication, etc., can solve problems such as disconnection of wiring, contact of wiring, and easy cutting of wiring, so as to enhance the overall strength Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment approach 1
[0036] Embodiment 1 (see Figure 1 to Figure 3 )
[0037] figure 1 The shown longitudinal sectional view is for explaining a structural example of the solid-state imaging device according to Embodiment 1 of the present invention. figure 2 for along figure 1 The floor plan made on the midline II-II. image 3 for along figure 1 Bottom view made at midline III-III.
[0038] Such as figure 1 with figure 2 As shown in , the solid-state imaging device according to the present invention has a wiring substrate 2 on which conductor wiring (not shown) is patterned, and the substrate 2 has a rectangular shape when viewed from above, and has an appropriate thickness. One surface (hereinafter referred to as "upper surface") of wiring substrate 2 is provided with cavity 3 whose bottom surface 5 has an appropriate depth with respect to the thickness of wiring substrate 2 and is parallel to the upper surface of wiring substrate 2 . Here, the outer shape of the bottom surface 5 of th...
Embodiment approach 2
[0045] Embodiment 2 (see Figure 5 to Figure 7 )
[0046] Figure 5 The shown longitudinal sectional view is for explaining a structural example of the solid-state imaging device according to Embodiment 2 of the present invention. Image 6 for along Figure 5 The floor plan made on the median line VI-VI. Figure 7 for along Figure 5 Bottom view taken from midline VII-VII.
[0047] Such as Figure 5 with Image 6 As shown in , an electronic component 22 and a spacer 25, both of which are rectangular when viewed from above, are disposed between the bottom surface 5 of the cavity 3 of the wiring substrate 2 and the solid-state image sensor 13, and fixed by an adhesive (not shown). . Other structures are the same as those in Embodiment 1.
[0048] The electronic part 22 includes a digital signal processor, a drive circuit for a CCD image sensor, a resistor, a capacitor, and the like for a built-on filter circuit. The electronic component 22 is provided with a plurality ...
Embodiment approach 3
[0049] Embodiment 3 (see Figure 8 )
[0050] Figure 8 The shown longitudinal sectional view is for explaining a structural example of a solid-state imaging device according to Embodiment 3 of the present invention. Such as Figure 8 As shown in , in Embodiment 3, except figure 1 In addition to the structure in Embodiment 1 shown, the void in the cavity 3 is filled with a sealant 26 . More specifically, the outer sides 4 of the solid-state image sensor 13, the adhesive layer 18 and the light-transmitting cover 17 and the inner side 4 of the cavity 3 (including the inner side and the flat side of the stepped portion 7) are filled with a sealant 26 made of synthetic resin. Space formed between surfaces 6). Other structures are the same as those in Embodiment 1. The sealant 26 is used to protect the wiring 20 and, moreover, to enhance the overall strength of the solid-state imaging device.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More