A printed circuit board and production method thereof

A printed circuit board and circuit board technology, which is applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., can solve the problems of high cost and limitation, and achieve the effects of convenience, shortening the manufacturing cycle, and ensuring the quality of production

Inactive Publication Date: 2006-09-27
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a printed circuit board and its manufacturing method to solve the problem of limited and high cost

Method used

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  • A printed circuit board and production method thereof
  • A printed circuit board and production method thereof
  • A printed circuit board and production method thereof

Examples

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Example Embodiment

[0028] The structure of the PCB board of the present invention is as follows figure 1 As shown in the figure, when designing the PCB, for the PCB trace that needs to carry a large current, design a certain width of the solder mask window above the trace, and then fill the solder mask window with solder when assembling the device on the PCB. When the solder melts, it is electrically combined with the trace, such as figure 2 As shown, it is equivalent to increasing the cross-sectional area of ​​the trace and improving the current-carrying capacity of the trace. According to the PCB structure, solder characteristics and welding process requirements, the design of the solder mask window has the following characteristics:

[0029] 1. The shape and number of solder mask openings are not limited, which is determined by the number and shape of the traces carrying large currents on the PCB;

[0030] 2. The direction of the solder mask opening is consistent with the direction of the ...

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PUM

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Abstract

The invention relates to a printed circuit board and relative producing method, for improving the current-carrying ability of circuit. Said circuit board comprises: routing and the welding-resistance layer covering said routing. Wherein, the welding-resistance layer comprises at least on welding-resistance window along the length of one routing; said window is filled with solder which is electrically combined with said routing; said routings are distributed on two surfaces of said circuit board and the windows are arranged on two surfaces too; and when there is one routing and several said windows, the windows are parallel arranged, and the length of window is the same with the length of routing. The producing method comprises: arranging at least one welding-resistance window along the length of at least one routing; filling solder into said window to electrically combine the routing.

Description

technical field [0001] The invention relates to a circuit board, and in particular provides a printed circuit board and a manufacturing method for improving the current-carrying capacity of wiring. Background technique [0002] A trace is a printed circuit on a PCB (Printed Circuit Board, printed circuit board), and the current-carrying capacity of the trace directly affects the power that the PCB board can carry. The resistance value of a conductor depends on the length, cross-sectional area and resistivity of the conductor. The same is true for the traces on the printed circuit board. Taking a trace with a rectangular cross section as an example, when the length of the trace is L, the thickness is T, the width is W, and the resistivity is ρ, its resistance is passed by the formula 1 Determined, the power P it can carry is determined by formula 2: [0003] R = ρ L S = ρ ...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K1/02H05K3/46H05K3/34H05K3/00
Inventor 周党群
Owner HUAWEI TECH CO LTD
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