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A printed circuit board and production method thereof

A printed circuit board and circuit board technology, which is applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., can solve the problems of high cost and limitation, and achieve the effects of convenience, shortening the manufacturing cycle, and ensuring the quality of production

Inactive Publication Date: 2006-09-27
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a printed circuit board and its manufacturing method to solve the problem of limited and high cost in the prior art when increasing the current carrying capacity of PCB traces by increasing the width and thickness of the traces

Method used

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  • A printed circuit board and production method thereof
  • A printed circuit board and production method thereof
  • A printed circuit board and production method thereof

Examples

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Embodiment Construction

[0028] The structure of the PCB board of the present invention is as figure 1 As shown, in PCB design, for PCB traces that need to carry high current, design a solder mask window with a certain width above the trace, and then fill the solder mask window with solder when assembling devices on the PCB. When the solder melts and electrically bonds with the trace, as figure 2 As shown, it is equivalent to increasing the cross-sectional area of ​​the wiring and improving the current carrying capacity of the wiring. According to the requirements of PCB structure, characteristics of solder and welding process, etc., the design of solder mask opening has the following characteristics:

[0029] 1. The shape and number of solder mask openings are not limited, and are determined by the number and shape of the traces carrying high current on the PCB;

[0030] 2. The direction of the solder mask opening is consistent with the direction of the trace, and it is distributed continuously al...

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PUM

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Abstract

The invention relates to a printed circuit board and relative producing method, for improving the current-carrying ability of circuit. Said circuit board comprises: routing and the welding-resistance layer covering said routing. Wherein, the welding-resistance layer comprises at least on welding-resistance window along the length of one routing; said window is filled with solder which is electrically combined with said routing; said routings are distributed on two surfaces of said circuit board and the windows are arranged on two surfaces too; and when there is one routing and several said windows, the windows are parallel arranged, and the length of window is the same with the length of routing. The producing method comprises: arranging at least one welding-resistance window along the length of at least one routing; filling solder into said window to electrically combine the routing.

Description

technical field [0001] The invention relates to a circuit board, and in particular provides a printed circuit board and a manufacturing method for improving the current-carrying capacity of wiring. Background technique [0002] A trace is a printed circuit on a PCB (Printed Circuit Board, printed circuit board), and the current-carrying capacity of the trace directly affects the power that the PCB board can carry. The resistance value of a conductor depends on the length, cross-sectional area and resistivity of the conductor. The same is true for the traces on the printed circuit board. Taking a trace with a rectangular cross section as an example, when the length of the trace is L, the thickness is T, the width is W, and the resistivity is ρ, its resistance is passed by the formula 1 Determined, the power P it can carry is determined by formula 2: [0003] R = ρ L S = ρ ...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K1/02H05K3/46H05K3/34H05K3/00
Inventor 周党群
Owner HUAWEI TECH CO LTD
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