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Heater that attaches electronic component to and detaches the same from substrate

A technology of electronic components and heaters, which is applied in the direction of printed circuits, electrical components, electrical components, etc. connected to non-printed electrical components, and can solve problems such as difficult to install BGA packages with high density

Inactive Publication Date: 2006-10-18
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is generally difficult to mount large BGA packages at high density 14A

Method used

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  • Heater that attaches electronic component to and detaches the same from substrate
  • Heater that attaches electronic component to and detaches the same from substrate
  • Heater that attaches electronic component to and detaches the same from substrate

Examples

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Embodiment Construction

[0048] An electronic device 100 according to an embodiment of the present invention will now be described with reference to the accompanying drawings. it's here, figure 1 is a schematic perspective view of the electronic device 100 . Such as figure 1 As shown, for the purpose of illustration, a rackmount type UNIX server is used as an example for implementing the electronic device 100 . The electronic device 100 is screwed to a stand (not shown) by a pair of brackets 102 and includes a printed board 110 in a housing 104 . A fan module 106 is disposed within the housing 104 . The fan module 106 rotates a built-in cooling fan to generate airflow and forcibly cool the cooling fins in the casing 104 .

[0049] The printed board 110 includes a BGA package (or electronic assembly) 120, a heater 150, a plurality of block plates (not shown) for inserting a memory card, and has external devices such as a hard disk drive ("HDD") and local area network ("LAN") connectors (not show...

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PUM

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Abstract

The present invention provides a heater for connecting an electronic component having a ball grid array structure to a substrate and removing the electronic component from the substrate on which the electronic component operates, the heater comprising: a body fixed to the electronic component; and a heating element disposed on the body, the heating element heats and melts the solder balls having a ball grid array structure when energized. Using the present invention, surrounding electronic components can be sufficiently protected from heat during remelting and rework, thereby achieving high-density mounting.

Description

[0001] This application claims foreign priority based on Japanese Patent Application No. 2005-116518 filed on April 14, 2005, the entire contents of which are hereby incorporated by reference as described herein. technical field [0002] The present invention relates generally to an apparatus for attaching and detaching electronic components to and from a substrate, and more particularly to an apparatus for attaching and detaching a ball grid array ("BGA") package to and from a printed board. Background technique [0003] With the recent development of smaller and higher-performance electronic devices, the demand for electronic devices capable of high-density mounting has grown significantly. BGA packages are often proposed to meet this need. Generally, a BGA package mounts an IC or LSI functioning as a CPU and a type of package board (which is soldered to a printed board, which is also called a "system board" or "motherboard"). BGA packages can achieve narrower pitches and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H01L23/40H05K1/18H05K13/04
CPCH01L24/799H01L2224/16225H01L2924/00011H01L2924/00014H05K1/0212H05K3/3436H05K2201/10734H05K2203/176Y02P70/50H01L2224/0401
Inventor 高田理映坪根健一郎
Owner FUJITSU LTD
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