Shielded electronic circuit unit and method of manufacturing the same

Abstract

A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is provided on a top surface of a sealing resin portion for burying an electronic component, the side surfaces of the sealing resin portion that are opposite to each other, and the side surfaces of the multi-layered substrate that are opposite to each other. The metallic film is connected to the grounding patterns that are provided on the top surface of the multi-layered substrate or between the laminated layers of the multi-layered substrate. Therefore, it is possible to achieve a superior electrical shielding effect through the metallic film, as compared with the related art. Since the metallic film is formed on the side surfaces of the sealing resin and the side surfaces of the multi-layered substrate, when the metallic film is formed by a plating method, the blind hole may not be provided in the related art. Therefore, it is possible to achieve the superior circulation of the plating liquid, which results in sure connection between the sure connection between the grounding pattern and the metallic film.

Description

technical field [0001] The present invention relates to a shielded electronic circuit unit suitable for use in voltage controllers and the like and a method of manufacturing the same. Background technique [0002] Figure 36 is a cross-sectional view of the main part of the existing electronic circuit unit, Figure 37 It is a cross-sectional view of main parts showing a conventional method of manufacturing an electronic circuit unit, and then, based on Figure 36 The structure of a conventional electronic circuit unit is described. A wiring pattern P1 having a signal pattern 52 and a ground pattern 53 is provided on a multilayer substrate 51, and the signal pattern 52 of the wiring pattern P1 is provided on the multilayer substrate 51. between the upper surface and the build-up layer (in the build-up layer), and has a terminal portion 52a provided on the lower part of the side surface of the multilayer substrate 51, and the ground pattern 53 is provided on the upper surface ...

AI Technical Summary

Problems solved by technology

[0010] However, in the conventional manufacturing method of the electronic circuit unit, the metal film 56 for electric shielding is provided only on the upper surface of the sealing resin part 55, so the electric shielding performed by the metal film 56 is insufficient, and because the metal The film 56 is provided in the blind hole 55a, so especially when the metal film 56 is formed by electroplating, the circulation of the plating solution in the blind hole 55a is insufficient, so that the adhesion of the metal film 56 to the second electrode 54b becomes poor. unreliable

[0011] Because the existing electronic circuit unit and its manufacturing method have a structure in which the metal film 56 for electrical shielding is provided only on the upper surface portion of the sealing resin portion 55, there is a problem that the electrical shielding performed by the metal film 56 is not sufficient. Sufficiently, and because the metal film 56 is arranged in the blind hole 55a, so especially when the metal film 56 is formed by electroplating, the circulation of the electroplating solution in the blind hole 55a is insufficient, so that the metal film 56 has a negative effect on the second The attachment of electrode 54b becomes unreliable

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