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Structure design of mobile terminal

A mobile terminal and structural design technology, applied in the field of structural design of mobile terminals, can solve the problems of power consumption, restricted development level, low communication quality and other problems at the same time, achieve local temperature sensitivity is not high, avoid local high temperature and , The effect of high thermal conductivity

Inactive Publication Date: 2006-12-13
HUAWEI TECH CO LTD
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  • Abstract
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Problems solved by technology

This solution is limited by the development level of hardware and software; it cannot achieve low power consumption and good communication quality at the same time
Therefore, this solution is difficult to use

Method used

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  • Structure design of mobile terminal
  • Structure design of mobile terminal
  • Structure design of mobile terminal

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Embodiment Construction

[0024] The internal cause of the uneven temperature distribution on the surface of the mobile terminal is the uneven heating of components on the circuit board PCB. The heating devices on the board PCB mainly include PA (power amplifier) ​​devices, LCD (liquid crystal screen), radio frequency chips, CPU, charging transistors, cameras, and shielding boxes near high temperatures. The higher temperature of the circuit arc area where these heating elements are located is called a relatively high temperature area, and other areas are called a relatively low temperature area. The most important heat source is the PA device, which usually accounts for 40-60% of the total heat consumption of the mobile terminal. For some PAs of WCDMA and CDMA 2000, the efficiency is below 40%, and the PA device size is usually 6×6×1.9mm 3 to 3×3×1.8mm 3 . Therefore, during long-term high-power transmission, the temperature rise of the housing can reach 30-50°C. In addition, due to the thinness of ...

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Abstract

The invention relates to a structure design of mobile terminal. Wherein, the relative high-temperature area of circuit board is arranged with heat emitter, to emit the heat of said area through the frame of mobile terminal; or the relative high-temperature area and relative low-temperature area are mounted with heat emitters, to transmit the heat of high-temperature area to the low-temperature area; the heat emitter is made from carbon (graphite), with high thermal conductivity and low density. The invention has low cost, small volume, better temperature uniformity and the application for avoiding partly high temperature of element and frame.

Description

technical field [0001] The invention relates to the structural design of products in the field of electronic technology, in particular to a structural design of a mobile terminal. Background technique [0002] In modern society, mobile phones, that is, mobile terminals, have become an indispensable communication tool for people. People have more and more requirements for the functions of mobile terminals. With the development of wireless communication and chip packaging technology, more functions can be integrated into mobile terminals. As the mobile terminal has more and more functions, the power consumption of the mobile terminal also tends to increase. Especially, the power consumption of the mobile terminal used in the third generation network is much higher than that of the original mobile terminal. However, people often hope that the smaller the size of the mobile terminal, the better. In this way, the pressure of customer demand and competition forces mobile termina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 靳林芳洪宇平
Owner HUAWEI TECH CO LTD
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