Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same

Abstract

There is provided a circuit substrate manufacturing method for manufacturing a circuit substrate in two steps: the first step for manufacturing a substrate at a substrate manufacturer (1) and the second step for mounting electronic parts on the substrate for manufacturing a circuit substrate at a mounting manufacturer (2). At one or more division stages, the substrate board (5) is divided via substrate sheets (6) to substrate pieces (7). By using the substrate board (5), identification information consisting of information associated with the entire substrate board and information indicating relative relationship by divisions at each division stage is recorded on respective information recording units (8, 9, 10) arranged to correspond to the substrates before and after the division at each division stage before the substrates are delivered from the substrate manufacturer (1) to the mounting manufacturer (2). By referencing the identification information, it is possible to easily trace the history, i.e., trace a manufacturing progress of the circuit substrate divided and a manufacturing history when a defect is caused while increasing the productivity of the circuit substrate by using the multi-piece substrate.

Description

technical field [0001] The invention relates to a method and system for producing a circuit board, in particular to a multi-part backplane that is divided in one or more division stages by a backplane manufacturer and is properly divided, and then circulated to an installation factory to be installed with electronic components. A circuit board production method and system for producing a circuit board as well as a multi-component base plate and circuit board thereof. Background technique [0002] Conventionally, in the production of circuit boards for various electronic devices, design data of a backplane based on circuit board design data is supplied to a backplane manufacturer. The backplane is produced at the backplane manufacturing plant based on the backplane design data. At this time, for production management and distribution management, the chassis manufacturer independently writes its identification information in batch units and individual chassis units. Next, th...

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Problems solved by technology

[0007] In order to solve this problem, it is necessary to include product production history in production so as to track at any time. However, the information written into individual products by manufacturers and other production entities can only be analyzed in each production entity unit, so there is a problem that it is impossible to realize

[0008] Moreover, what is disclosed in the above-mentioned Patent Document 1 and Patent Document 2 can only be applied to a product produced by one of the production bodies such as a manufacturer, and cannot solve this problem.

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