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Refrigerating device

A refrigeration device and heat dissipation device technology, applied in the direction of refrigerators, refrigeration and liquefaction, machines using electric/magnetic effects, etc., can solve energy waste, low efficiency of cooling medium to absorb heat, and inability to fully exert the refrigeration function of semiconductor refrigeration components and other issues, to achieve the effect of improving cooling efficiency, improving heat dissipation efficiency, and improving heat absorption efficiency

Active Publication Date: 2007-03-14
QINGDAO HAIER BIOMEDICAL CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

The technical solution provided by the above patent can improve the heat dissipation efficiency of the hot end of the semiconductor refrigeration element to a certain extent, but the heat absorption efficiency of the cooling medium in the heat dissipation system is still relatively low, and the heat dissipation efficiency is limited to a certain extent. Can not be fully utilized, resulting in a waste of energy

Method used

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Embodiment Construction

[0036] A kind of refrigerator or electric freezer 6 that is provided with gravity heat pipe type radiator as shown in Fig. 9, Fig. 10, this refrigerator or electric freezer is a single box structure, for illustrating the semiconductor refrigeration element and gravity heat pipe type radiator Structure, the refrigerator or freezer can adopt other structural forms, in Fig. 9, Fig. 10 is convenient for explaining the problem, has omitted the door body of refrigerator or freezer in the illustration;

[0037]The refrigerator or freezer 6 includes a casing 61, and a hole 7 is opened on the rear wall 62 of the casing 61. The inside of the hole 7 corresponds to a semiconductor refrigeration element 4, and the semiconductor refrigeration element 4 faces the inner side of the refrigerator casing. It is the cold end, and the side facing the outside of the refrigerator box is the hot end. The liquid storage box 1 of the gravity heat pipe type heat sink is attached to the hot end of the sem...

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Abstract

The invention provides a refrigerant device, comprising semiconductor refrigerant component, which comprises hot end and coo end. On the said hot end heat radiator is set and said heat radiator comprises fluid storage box bonded with the hot end of semiconductor refrigerant component. Said fluid storage box is connected with heat radiator and cooling medium is filled between them. The partial wall, which is jointed with the hot end, is concave towards to the inner of fluid storage box and said fluid storage box is partially trapezoid. The small end of trapezoid part of said fluid storage box is jointed with the hot end of semiconductor refrigerant component and the end relative to the small end is concave towards to inner of fluid storage box. Box part, extruding to fluid storage box, is set back-up of fluid storage box. Said heat radiator is multiple and is connected with said fluid storage box separately. There is rational structure for gravitational thermal pipe radiator, high heat radiator efficiency for radiator, high refrigerant efficiency for refrigerant device.

Description

technical field [0001] The invention relates to a refrigeration device, in particular to a refrigeration device provided with a gravity heat pipe type radiator. Background technique [0002] Semiconductor refrigeration technology has the characteristics of small size, no pollution, no noise, and simple structure, so it can be applied to many occasions. The principle of semiconductor refrigeration technology is to generate heat absorption and heat release through the potential energy changes of electrons and holes in the energized circuit. The semiconductor refrigeration components generate cold ends and hot ends, and then realize the functions of cooling and heating. When the semiconductor refrigeration element is in thermal balance, to improve the cooling capacity of the cooling end, the main link is to improve the heat dissipation efficiency of the hot end, reduce the heat accumulation at the hot end, and minimize the temperature difference between the two ends to obtain m...

Claims

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Application Information

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IPC IPC(8): F25B21/02
Inventor 刘占杰佟少臣赵立润李正生张江涛
Owner QINGDAO HAIER BIOMEDICAL CO LTD