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Method for continuously producing flexible printed circuit board

A flexible printing and circuit board technology, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve problems affecting the continuity of the process, affecting the quality and accuracy of the circuit, friction, and damaging the circuit.

Inactive Publication Date: 2007-03-28
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This manufacturing method greatly improves production efficiency. However, the precision of the flexible circuit is high, and the obtained flexible circuit tape is directly rolled up on the reel. Friction damage will inevitably occur during the rolling process, which will affect the quality and accuracy of the circuit. ; In addition, ear material debris formed by punching, cutting and other processes will affect the continuity of the process
[0004] Therefore, it is necessary to provide a method for continuous production of flexible printed circuit boards, which can effectively avoid friction and damage of flexible printed circuit boards during the production process that affect the quality and accuracy of the circuit.

Method used

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  • Method for continuously producing flexible printed circuit board
  • Method for continuously producing flexible printed circuit board

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Embodiment Construction

[0012] A method for continuously producing flexible printed circuit boards will be described in detail below with reference to the accompanying drawings and embodiments.

[0013] As shown in Figure 1, the method for continuous production of flexible printed circuit boards according to the embodiment of the present invention includes the following steps: providing a base, which includes a conductive layer and a flexible substrate layer; processing conductive circuits on the base; A back film is arranged on the substrate processed with conductive lines; a plurality of flexible printed circuit boards are molded and arranged on the back film at intervals.

[0014] The flexible printed circuit board in the embodiment of the present invention includes ordinary flexible printed circuit board (FPCB) and COF flexible printed circuit board, also known as chip-on-film, or called flexible chip direct assembly circuit board. A circuit board is taken as an example to illustrate the method f...

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Abstract

The invention relates to a kind of method of continuously producing flexible press circuit board. The step is as follows. There is a base including a conducting layer and a flexible backing layer. The conducting circuit and the back film are set on the base. Multiple flexible press circuit boards are formed and array on the back film interval. It is characterized in that the back film is set on the base to make multiple flexible press circuit boards stick on the base film. They are packed in roll and protected. Furthermore, the back film is sticking to make the wastes forming in manufacturing stick on the base film and not fall down to keep process continuous.

Description

【Technical field】 [0001] The invention relates to a method for manufacturing a flexible printed circuit board, in particular to a method for continuously producing a flexible printed circuit board. 【Background technique】 [0002] Flexible Printed Circuit Board (Flexible Printed Circuit Board, FPCB), also known as flexible printed circuit board, or flexible printed circuit board, refers to a printed circuit made of flexible insulating substrates, which can be freely bent, wound or Folding can be arranged arbitrarily according to the requirements of space layout, and can be moved and stretched arbitrarily in three-dimensional space, which has many advantages that rigid printed circuit boards do not have. COF (Chip On Film, COF) flexible printed circuit board, also known as chip-on-film, or flexible chip direct assembly circuit board, refers to a special flexible printed circuit board, which is often used in mobile phones and notebook computers. Its integration level is higher...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/03H05K1/09
Inventor 许家硕黄福兴王朝庆
Owner AVARY HLDG (SHENZHEN) CO LTD