Gap-type printed circuit board radiating layout

Abstract

The invention discloses a layout of batch dispelling heat for PCB. It is grid structure distributed around or at the bottom of the transformers. The advantages of the invention are: the simple structure increases design residual of transformer and the heating element, at the same time, it meet the needs of intensive installation.

Description

technical field [0001] The invention relates to a design layout of a printed circuit board, in particular to a heat dissipation design layout near a transformer. Background technique [0002] In power supply electronic products, heating components such as transformers and power switching components will generate a lot of heat during work. In order to ensure the normal operation of the product, the heating components need to be designed for heat dissipation. On a heat dissipation layout made of metal materials such as copper, in order to better dissipate heat, the heat dissipation components need to be designed with a very large area of ​​heat dissipation layout, but if the heat dissipation layout is set near the transformer, it will be between the metal material and the transformer. Another magnetic circuit will be formed between the iron cores, which will increase the load of the transformer, increase the temperature of the transformer a lot, and reduce the efficiency. At t...

AI Technical Summary

Problems solved by technology

[0002] In power supply electronic products, heating components such as transformers and power switching components will generate a lot of heat during work. In order to ensure the normal operation of the product, the heating components need to be designed for heat dissipation. On a heat dissipation layout made of metal materials such as copper, in order to better dissipate heat, the heat dissipation components need to be designed with a very large area of ​​heat dissipation layout, but if the heat dissipation layout is set near the transformer, it will be between the metal material and the transformer. Another magnetic circuit will be formed between the iron cores, which will increase the load of the transformer, increase the temperature of the transformer a lot, and reduce the efficiency. At the same time, the formed magnetic circuit will form an eddy current on the heat dissipation layout, generate heat, and directly affect heat dissipation. Thermal effect of the layout

In order to ensure the normal use of electronic products, it is necessary to increase the design margin of transformers and heating components, which will increase the corresponding cost and energy consumption. Design the heat dissipation layout of metal materials such as copper laying on the bottom, especially the primary side, and ensure that the heat dissipation layout of the heating components has a certain distance away from the transformer. Circumstances create technical barriers that do not adapt to the development trend of miniaturization of electronic products

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