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49results about How to "Large design margin" patented technology

Method of analyzing operation of semiconductor integrated circuit device, analyzing apparatus used in the same, and optimization designing method using the same

In a method of analyzing a power noise based on the circuit information of a semiconductor integrated circuit device, the power noise is analyzed in consideration of the influence of the impedance of a substrate. Consequently, the impedance of the substrate which has not been conventionally considered is taken into consideration. Thus, precision in the analysis can be enhanced more greatly.
Owner:PANASONIC CORP

Capacitor built-in substrate and method of manufacturing the same and electronic component device

A capacitor built-in substrate of the present invention includes; a base resin layer; a plurality of capacitors arranged side by side in a lateral direction in a state that the capacitors are passed through the base resin layer, each of the capacitors constructed by a first electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively such that the projection portion on one surface side of the base resin layer serves as a connection portion, a dielectric layer for covering the projection portion of the first electrode on other surface side of the base resin layer, and a second electrode for covering the dielectric layer; a through electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively; and a built-up wiring formed on the other surface side of the base resin layer and connected to the second electrodes of the capacitors and one end side of the through electrode.
Owner:SHINKO ELECTRIC IND CO LTD

Capacitor built-in interposer and method of manufacturing the same and electronic component device

A capacitor built-in interposer of the present invention, includes a base resin layer, a capacitor first electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively whereby the projection portion on one surface side of the base resin layer serves as a connection portion, a capacitor dielectric layer for covering the projection portion of the first electrode on other surface side of the base resin layer, and a capacitor second electrode for covering the dielectric layer, wherein a plurality of capacitors each constructed by the first electrode, the dielectric layer, and the second electrode are arranged and aligned in a lateral direction in a state that the capacitors are passed through the base resin layer.
Owner:SHINKO ELECTRIC IND CO LTD

Capacitor built-in substrate and method of manufacturing the same and electronic component device

InactiveUS7936568B2Large design marginInductance between the semiconductor chip and the capacitors can be reducedSemiconductor/solid-state device detailsSolid-state devicesEngineeringElectronic component
A capacitor built-in substrate of the present invention includes; a base resin layer; a plurality of capacitors arranged side by side in a lateral direction in a state that the capacitors are passed through the base resin layer, each of the capacitors constructed by a first electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively such that the projection portion on one surface side of the base resin layer serves as a connection portion, a dielectric layer for covering the projection portion of the first electrode on other surface side of the base resin layer, and a second electrode for covering the dielectric layer; a through electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively; and a built-up wiring formed on the other surface side of the base resin layer and connected to the second electrodes of the capacitors and one end side of the through electrode.
Owner:SHINKO ELECTRIC IND CO LTD

Laser triangular displacement sensor and correction method of non-linear errors of laser triangular displacement sensor

The invention discloses a laser triangular displacement sensor and a correction method of the non-linear errors of the laser triangular displacement sensor, belonging to the technical field of photoelectric measurement. The laser triangular displacement sensor comprises a semiconductor laser device, a focusing lens set, a receiving lens set, a photoelectric detector and a signal processing circuit, wherein the semiconductor laser device and the focusing lens set are coaxial, and the semiconductor laser device, the focusing lens set and a detected target are arrayed in sequence to commonly form a transmitting terminal; the receiving lens set and the photoelectric detector are arrayed in sequence; and the signal processing circuit is connected with the photoelectric detector and is used for processing an electric signal received by the photoelectric detector to obtain displacement of the detected target. The laser triangular displacement sensor provided by the invention has very high displacement measurement precision; the displacement of a common scattering object can be measured and the displacement of a mirror surface reflection object can be measured; meanwhile, in the receiving lens set, a lens is subjected to inclination or eccentric treatment and the non-linear errors are corrected based on a principle; and an economical and effective method is provided for improving a problem that the resolution ratio is not uniform.
Owner:HEBERSON TECH (SHENZHEN) CO LTD

Micro light emitting device and display apparatus

A micro light emitting device including a component layer, a first electrode and a second electrode is provided. The component layer includes a main body and a protruding structure disposed on the main body. The first electrode is electrically connected to the component layer. The second electrode is electrically connected to the component layer. The first electrode, the second electrode and the protruding structure are disposed on the same side of the main body. The protruding structure is located between the first electrode and the second electrode. A connection between the first electrode and the second electrode traverses the protruding structure. The main body has a surface. The protruding structure has a first height with respect to the surface. Any one of the first electrode and the second electrode has a second height with respect to the surface. The relation 0.8≤H1 / H2≤1.2 is satisfied, wherein H1 is the first height and H2 is the second height. A display apparatus having a plurality of micro light emitting devices is provided as well.
Owner:PLAYNITRIDE DISPLAY CO LTD

Method for removing welding residual stresses

The invention discloses a method for removing welding residual stresses. The method includes the following steps that first, a temperature distribution field of welding parts is calculated at first, and the distribution and dimensions of the welding residual stresses around a welded joint are calculated according to the temperature distribution field; and second, the external force and moment of force are applied to the welding parts beside a welded splice, and plastic deformation of the welding parts is caused so that the welding residual stresses calculated in the first step can be removed.By adoption of the method, the residual stresses of the welding parts can be effectively removed, and the problems of stress corrosion cracking and high-temperature fatigue cracking of the welding parts are solved.
Owner:吴谦

Atmospheric data computer detection system

The invention discloses an atmospheric data computer detection system. The system comprises a control system, a signal modulation unit, a power control unit and a program control pressure source. Thecontrol system comprises an industrial control computer and various function board card inlaid into the main board of the industrial control computer as a whole control center and an operation platform; the signal modulation unit comprises a discrete signal input module, a discrete signal output module and a high-precision controllable resistor network for modulation of two types of discrete signals consisting of 'ground / overhang' and '28V / overhang' signals to achieve level conversion, control of the total temperature simulation device and output of different total temperature resistances andcontrol a digital multimeter by a relay to achieve the power source monitoring and measurement of output resistance. The problems are solved that a traditional atmospheric data computer test device istedious in operation and use steps and poor in operability and versatility.
Owner:AIR FORCE ENG UNIV OF PLA AIRCRAFT MAINTENACE MANAGEMENT SERGEANT SCHOOL

Wind driven straight-wing propeller remote control unmanned ship

The invention discloses a wind driven straight-wing propeller remote control unmanned ship. Two ship demihulls of the unmanned ship are arranged on the lower portions of the two ends of a frame structure in a spaced mode; a rotary main shaft of a lift force type perpendicular shaft wind wheel is vertically arranged at the upper end of the middle portion of a longitudinal girder, multiple lift force type blades are vertically arranged at intervals in the circumferential direction with the rotary main shaft as a center line, the upper end and the lower end of each lift force type blade are connected with the outer end of a connecting board, and the inner ends of the connecting boards are connected with the rotary main shaft; the rotary main shaft penetrates through a wind driven generator and extends downwards to the input end of a gearbox; and the output end of the gearbox is connected with the front end of a transmission shaft, and the rear end of the transmission shaft is connected with the input end of a straight-wing propeller. Wind power is used for directly driving the unmanned ship propeller to rotate to propel the unmanned ship to sail, a storage battery carried along the ship is charged through solar cell panels and the wind driven generator installed on a hull so as to serve as stored energy, and the theoretical infinite endurance of the unmanned ship is achieved.
Owner:SOUTH CHINA UNIV OF TECH +1

LED light-emitting structure and light-emitting spike with same

The invention discloses an LED light-emitting structure and a spike with the same. The LED light-emitting structure comprises a transparent shell (1), an LED luminous body (2) with a light condensingelement, a separation body (3) and an air layer (4), the LED luminous body (2) is packaged in the transparent shell (1) through the separation body (3), light emitted by the LED luminous body (2) is mainly condensed by the condensing element, incident by an inner inclined surface (1b), refracted by a side wall with a certain thickness, emitted by an outer inclined surface (1a), emitted in the horizontal direction, mainly emitted in the upward direction and supplemented by emitted in the horizontal direction, and the LED luminous body (2) emits light in the horizontal direction to generate a local structure capable of generating upward displacement. The horizontal emergent light intensity ratio is high, the light energy utilization rate is high, the structural design allowance delta H and the power supply design allowance are improved, the structural strength is high, the forming process of the shell is facilitated, the light emitting intensity ratio in the horizontal direction and theupward direction are reasonably distributed so as to be more suitable for different emphasis points of vehicles and pedestrians, and the diversified requirements of roads are well met.
Owner:方显峰

Integrated semiconductor bridge transduction element

The invention provides an integrated semiconductor bridge transduction element. The integrated semiconductor bridge transduction element comprises more than two semiconductor bridges, wherein at least one semiconductor bridge is used for absorbing electromagnetic interference energy, and other semiconductor bridges are used for converting input energy into plasma ignition energy; a resistance value, a bridge area and a bridge shape of at least one semiconductor bridge are different from that of other semiconductor bridges; resistance values, bridge areas or bridge shapes of all semiconductor bridges are determined according to ignition positions and timing sequence; all of the semiconductor bridges are connected in series or in parallel or are in series-parallel connection, and the resistance values, the bridge areas or the bridge shapes of all of the semiconductor bridges can be determined according to the ignition positions and the timing sequence; and open circuit resistors are integrated in the bridge areas or electrode areas. According to the integrated semiconductor bridge transduction element, the safety and the reliability are increased, and multi-point sequential ignition can be realized.
Owner:司马博羽

Method and apparatus for manufacturing a Liquid Crystal Display panel

A method for manufacturing a Liquid Crystal Display (LCD) panel has irradiating a position on a substrate used for the LCD panel with ultraviolet rays and performing a process to the position before predetermined time elapses. An LCD panel manufacturing apparatus for manufacturing an LCD panel of the present invention has a process unit including a ultraviolet cleaning unit which irradiates a predetermined position on a substrate with ultraviolet rays and a processing head which performs a predetermined process to the predetermined position on the substrate, the processing head being located at a predetermined distance from the ultraviolet cleaning unit, and a mobile unit which moves at least one of the process unit and the substrate so as to shift the processing head to the predetermined position before a predetermined time elapses.
Owner:NEC LCD TECH CORP

Communication device, dielectric waveguide filter and design method thereof for suppressing far-end harmonic waves

The invention relates to a communication device, a dielectric waveguide filter and a design method thereof for suppressing far-end harmonics. The dielectric waveguide filter comprises a dielectric block and a metal layer. The dielectric block is provided with a first surface and a second surface which are opposite to each other. The first surface is provided with a capacitive coupling hole, and the capacitive coupling hole extends from the first surface to the second surface. The first surface is further provided with a first frequency hole, and the first frequency hole is located on one sideof the capacitive coupling hole. The second surface is provided with a first blind hole, and the first blind hole is located on the other side of the capacitive coupling hole. The first blind hole canwell inhibit far-end harmonic waves generated by capacitive coupling, so that better electrical performance can be realized, the influence of the harmonic waves generated by capacitive coupling on acommunication system is further solved, and the filter has larger design allowance during design. Besides, the first blind hole can also be used for adjusting the capacitance coupling amount, and thedeeper the first blind hole is, the larger the capacitance coupling amount is, so that the filter is more flexible in design.
Owner:COMBA RF TECH GUANGZHOU LTD +1

Residual current protection tripping mechanism and tripper

The invention discloses a residual current protection tripping mechanism and a tripper, wherein the tripping mechanism comprises a draw bar and a jump pin which are interacted with each other, so the jump pin moves between a normal working position and a tripping position, the draw bar is provided with a first joint part and a second joint part, the first joint part is interacted with a residual current protection rod of a residual current protection device, so the draw bar moves, the jump pin is further actuated to trip, the second joint part is interacted with at least one of an overload protection device and a short circuit protection device, so the draw bar moves, and the jump pin is further driven to trip. The residual current protection device, the overload protection device, the short circuit protection device and the like use one tripping protection mechanism together, so the structure is simplified, and the cost is saved.
Owner:SCHNEIDER ELECTRIC IND SAS

MEMS inertial sensor and making method of same

The invention discloses an MEMS inertial sensor and a making method of the same. The MEMS inertial sensor includes a substrate, and two cover bodies which are respectively fixed on an upper end and a lower end of the substrate. A first accommodating chamber and a second accommodating chamber are respectively formed by the two cover bodies and the substrate at the two sides of the substrate. At the upper end of the substrate, a first sensitive structure is arranged in the first accommodating chamber through a middle combining layer. At the lower end of the substrate, a second sensitive structure is arranged in the second accommodating chamber through a middle combining layer. According to the MEMS inertial sensor, the substrate is arranged at the middle of a chip and sensitive structures are bonded to the upper surface and the lower surface respectively of the substrate, so that the MEMS inertial sensor has a double-layer sensitive structure, thereby increasing the utilization ratio of chip area, improving the total performance of the MEMS inertial sensor, increasing the sensitivity by one times and increasing signal-noise ratio; in other words, the MEMS inertial sensor, compared with a conventional MEMS inertial sensor, on the basis of not reducing the performance of the chip, is further reduced in size, thereby satisfying small-size development of electronic products.
Owner:GOERTEK MICROELECTRONICS CO LTD

Organic light emitting diode display pane

The invention provides an organic light emitting diode display panel, which aims at solving the problems of narrower routing width and larger routing resistance of an auxiliary electrode of the prior art. The display panel comprises a substrate 240, an organic function layer 250 and a flattening layer 200, wherein an opaque electrode 211, the auxiliary electrode 212, an insulation organic layer 260 and a transparent electrode layer 230 are arranged on the flattening layer 200, the insulation organic layer 260 is covered on the opaque electrode 211 and the auxiliary electrode 212, the transparent electrode layer 230 is arranged on the insulation organic layer 260, a pixel defining layer 213 is positioned between the opaque electrode 211 and the auxiliary electrode 212, and is in contact with the two adjacent ends of the opaque electrode 211 and the auxiliary electrode 212, a conductive function layer 220 is arranged on the opaque electrode 211, the thickness of the conductive function layer 220 is greater than the thickness of the insulation organic layer 260, and the auxiliary electrode 212 is connected with the transparent electrode layer 230 through the conductive function layer 220.
Owner:HISENSE VISUAL TECH CO LTD

Semiconductor device having delay control circuit

A first delay circuit and a second delay circuit having different operation conditions from each other, a detection circuit that detects a difference in propagation speed of a pulse signal, which is simultaneously input to the first and second delay circuits, and a setting circuit that generates a selection signal based on a detection result from the detection circuit are provided. The selection signal is supplied to a delay control circuit that generates an operation timing signal by delaying a reference signal, of which a delay amount is controlled by the selection signal. With this arrangement, a necessity to set the delay amount of the delay control circuit with a large design margin can be eliminated considering PVT variation, and as a result, performance degradation can be prevented.
Owner:LONGITUDE LICENSING LTD

n-type ldmos device and manufacturing method thereof

The application discloses an n-type LDMOS device and a manufacturing method thereof. A p-type silicon substrate is internally provided with a deep n well and a low-doped p well I; the deep n well is internally provided with a low-doped p well II, a heavy-doped p well II and a heavy-doped n well II; the low-doped p well II is internally provided with a heavy-doped n well I; the heavy-doped p well II is internally provided with a source electrode and a body region extraction region; the heavy-doped n well I is internally provided with a drain electrode; the heavy-doped n well II is internally provided with a protection ring extraction region; parts of the heavy-doped n well II, the low-doped p well II and the heavy-doped n well I are provided with grid oxide layers; the grid oxide layers and a partial isolation structure IV adjacent to the grid oxide layers are provided with polysilicon grid electrodes; the low-doped p well I is internally provided with an annular heavy-doped p well I; the heavy-doped p well I is internally provided with a substrate extraction region; the surface of a silicon material is provided with multiple isolation structures. According to the n-type LDMOS device, the longitudinal punch-through voltage of a parasitic PNP triode in the n-type LDMOS device is improved, and the withstand voltage of a PN knot between the substrate and the deep n well is not changed.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

4G metal antenna

A 4G metal antenna include antenna feed contact, antenna ground contact, antenna RF copper wire, A low frequency broadband S-shaped copper wire, first high frequency broadband copper wire, S-shaped copper wire for earthing return line, a first high frequency broadband cooper wire, an earthing return line and a second coupling plate. The antenna feed contact, the antenna ground contact and the antenna radio frequency copper wire are all installed on the double-sided PCB board, and the antenna feed contact is connected with the core copper wire of the antenna feed copper wire, and the antenna ground contact is connected with the shielding layer of the antenna feed copper wire. The 4G metal antenna can effectively solve the problem of bandwidth expansion and multi-frequency band comprehensivematching in antenna design by expanding bandwidth and multi-frequency band comprehensive matching. The 4G metal antenna has a large design redundancy, can expand bandwidth in a large range, and achieve multi-frequency band coverage.
Owner:深圳通诚无限科技有限公司

Light-emitting display unit and display apparatus

A light-emitting display unit including first to third metal layers, first to second insulation layers and micro light-emitting devices is provided. The first metal layer has conductive patterns. The second metal layer has transfer patterns. The third metal layer has pad patterns. The second metal layer is located between the first metal layer and the third metal layer. A distribution density of the first metal layer is less than that of the second metal layer, and greater than that of the third metal layer. The first insulation layer is disposed between the first metal layer and the second metal layer. The second insulation layer is disposed between the second metal layer and the third metal layer. The micro light-emitting devices are disposed on one side of the first metal layer away from the second metal layer, and electrically bonded to the conductive patterns. A display apparatus adopting the light-emitting display unit is also provided.
Owner:PLAYNITRIDE DISPLAY CO LTD

Cmos-inverter-type frequency divider circuit, and mobile phone including the cmos-inverter-type frequency divider circuit

The present invention provides a CMOS-inverter-type frequency divider circuit that can further reduce power consumption.The CMOS-inverter-type frequency divider circuit includes: a plurality of CMOS inverters that contribute to realizing a frequency division function; a frequency division control section for performing control such that some or all of the plurality of CMOS inverters are intermittently driven at the respective different timings in accordance with an input signal; and a drive power supplying section for supplying powers for driving the plurality of CMOS inverters, and for, based on state information indicating whether VCO sub band selection or normal transmission is performed, switching some or all of the powers for the plurality of CMOS inverters between the VCO sub band selection and the normal transmission.
Owner:PANASONIC CORP

Low-temperature negative-pressure drying system for heat-sensitive materials

The invention discloses a low-temperature negative-pressure drying system for heat-sensitive materials. The system comprises a pretreated material collection tank, a to-be-treated material preheatingtank, a low-temperature negative-pressure drying unit, a steam compression system, a concentrated material treatment system, a heat exchange steam treatment system and a steam scrubber tower system, wherein the pretreated material collecting tank is communicated with a to-be-treated material preheating tank, and the to-be-treated material preheating tank is connected with a feeding hole of the low-temperature negative-pressure drying unit through a conveying pipeline and a conveying pump; the steam compression system is connected with a compressed steam inlet of the low-temperature negative-pressure drying unit; the concentrated material treatment system is connected with a concentrated material outlet of the low-temperature negative-pressure drying unit; wherein the concentrated materialtreatment system is connected with a to-be-treated material preheating pool through a waste heat gas conveying pipeline and a waste heat gas conveying fan, the heat exchange steam treatment system isconnected with a heat exchange steam outlet of the low-temperature negative-pressure drying unit, and the steam scrubber tower system is connected with the low-temperature negative-pressure drying unit and the steam compression system. The system has the advantages of low heat energy consumption, low operation cost and no pollution to the environment.
Owner:商洛市海蓝科技有限公司

A Laser Triangular Displacement Sensor and Its Nonlinear Error Correction Method

The invention discloses a laser triangular displacement sensor and a correction method of the non-linear errors of the laser triangular displacement sensor, belonging to the technical field of photoelectric measurement. The laser triangular displacement sensor comprises a semiconductor laser device, a focusing lens set, a receiving lens set, a photoelectric detector and a signal processing circuit, wherein the semiconductor laser device and the focusing lens set are coaxial, and the semiconductor laser device, the focusing lens set and a detected target are arrayed in sequence to commonly form a transmitting terminal; the receiving lens set and the photoelectric detector are arrayed in sequence; and the signal processing circuit is connected with the photoelectric detector and is used for processing an electric signal received by the photoelectric detector to obtain displacement of the detected target. The laser triangular displacement sensor provided by the invention has very high displacement measurement precision; the displacement of a common scattering object can be measured and the displacement of a mirror surface reflection object can be measured; meanwhile, in the receiving lens set, a lens is subjected to inclination or eccentric treatment and the non-linear errors are corrected based on a principle; and an economical and effective method is provided for improving a problem that the resolution ratio is not uniform.
Owner:HEBERSON TECH (SHENZHEN) CO LTD

A photoelectric composite connector

A photoelectric composite connector, comprising a socket body provided with a socket sealing chamber and a plug body provided with a plug sealing chamber, the socket sealing chamber is composed of an inner wall of a movable sleeve, an outer wall of a first optical fiber module support member in the socket, and a first optical fiber module support member in the socket. Surrounded by insulators, the movable sleeve bends the optical pins obliquely protruding from the first optical fiber module support to be arranged axially along the socket body, and a movable column and an obliquely arranged jack are arranged in the plug sealing cavity. During the process, the first optical fiber module support pushes the movable column into the plug sealing chamber, the movable sleeve slides into the socket body relative to the first optical fiber module support, the elastic tube restores the tilting device, and the optical pin is arranged in the elastic tube, thereby realizing The optical pin is inserted into the optical jack. The invention has good sealing performance, can realize the underwater plugging and unplugging of the connector, prevents external liquid from entering into the chamber of the connector during the underwater plugging and unplugging process, and ensures the cleanliness of the optical contacts during the underwater plugging and unplugging process.
Owner:CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD

Self-compensating single-way precise conductivity detection alarm with symmetrical leads

The invention discloses a self-compensating single-way precise conductivity detection alarm with symmetrical leads, which comprises a display device and a built-in circuit board, wherein the display device comprises a liquid crystal touch screen, a display window, an operation button and an indicator lamp; the built-in circuit board comprises a main board and a display board; and the main board is electrically connected to the display board. The self-compensating single-way precise conductivity detection alarm with symmetrical leads is used for detecting and monitoring the conductivity in real time, has the advantages of high measuring precision, comprehensive anti-interference property, high degree of automation, high degree of intellectualization, low manufacturing cost and the like, is reliable in working, and is convenient to operate, manufacture and maintain.
Owner:SOUTH CHINA UNIV OF TECH

Gap-type printed circuit board radiating layout

The invention discloses a layout of batch dispelling heat for PCB. It is grid structure distributed around or at the bottom of the transformers. The advantages of the invention are: the simple structure increases design residual of transformer and the heating element, at the same time, it meet the needs of intensive installation.
Owner:SUMIDA ELECTRIC H K COMPANY
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