Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method

Abstract

This invention relates to one semiconductor cooling device special tube dissipation fin and its process method, which comprises space tube and top and down level tubes by welding to form dissipation chamber, wherein, the dissipation chamber is connected to evaporator through pipes with two ends as blind ends; the level and stand tube surfaces are distributed with tangent line at angle alphaalong bar fins with 0degree<alpha<= 90degree to process each part through protruding, impacting or other process for dissispation device.

Description

technical field [0001] The invention belongs to a radiator and a preparation method thereof, in particular to a fin-tube radiator for semiconductor refrigeration equipment and a preparation method thereof. Background technique [0002] The current public information shows that the overall structure of the standpipe radiator is completed by artificial assembly and welding by punching connection holes between the upper and lower horizontal pipes and the standpipe and adding cooling wires. The horizontal tube generally adopts the welding of the light pipe and the standpipe. The heat dissipation area of ​​the original horizontal pipe and the standpipe is solved by using the light pipe plus welding heat dissipation wire and heat sink, so the gap between the light pipe, the heat dissipation wire and the heat sink is caused. For spot welding contact, not only the heat dissipation area is limited by the welding point, but also the heat transfer efficiency is only 20% to 30% of the o...

AI Technical Summary

Problems solved by technology

The horizontal tube generally adopts the welding of the light pipe and the standpipe. The heat dissipation area of ​​the original horizontal pipe and the standpipe is solved by using the light pipe plus welding heat dissipation wire and heat sink, so the gap between the light pipe, the heat dissipation wire and the heat sink is caused. For spot welding contact, not only the heat dissipation area is limited by the welding point, but also the heat transfer efficiency is only 20% to 30% of the overall structure heat transfer efficiency

This type of radiator has a large number of solder joints on the surface of the heat pipe, and the welding process is complicated, which can only be limited to manual welding, and cannot achieve industrialized mass production. It is difficult to achieve standardized production of parts and components, and the welding quality is not guaranteed.

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