Electronic device with dual heat radiation structure

Abstract

This invention relates to one electron device with double dissipation structure, which comprises the following parts: circuit board with first and second dissipation surface; main dissipation structure set in first dissipation surface; assistant dissipation structure set on second dissipation surface; connection part to connect assistant structure to main one, wherein, circuit board second dissipation surface electron system environment for one heat flow relative high temperature to make circuit second dissipation to generate heat energy by assistant structure to main dissipation structure.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device with a double heat dissipation structure. Background technique [0002] With the advancement of technology, the operating efficiency of electronic devices continues to increase. In order to meet the needs of improving operating efficiency and execution speed, and to meet the trend of product miniaturization, the volume of electronic devices must be continuously reduced, and the internal structure must be more compact. . Therefore, the internal printed circuit boards of electronic devices such as power converters are usually designed as double-sided or even multi-layer boards. [0003] Generally speaking, the electronic components on the printed circuit board, such as capacitors, transistors, resistors, inductors, transformers, diodes, etc., are high-power heating components. A large amount of heat energy is generated on the board. Although heat dissipation is very i...

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Problems solved by technology

[0007] The main purpose of the present invention is to provide an electronic device, which has a main heat dissipation structure and an auxiliary heat dissipation structure, wherein the main heat dissipation structure is arranged on the first heating surface where the heat dissipation environment is relatively good, and the auxiliary heat dissipation structure is arranged on the first heating surface where the heat dissipation environment is relatively good. On the second heating surface with a relatively poor heat dissipation environment, it is used to conduct the heat energy generated by the second heating surface of the circuit board to the main heat dissipation structure through the auxiliary heat dissipation structure and a connecting part, so as to help the electronic device to dissipate heat evenly, thereby solving the problem of Traditional electronic devices only have a heat sink on one side of the circuit board, resulting in the inability to dissipate heat evenly on the side without the heat sink, which in turn causes damage to electronic components, and the electronic device cannot operate stably.

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