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Method for binding paper board, package box mfg. method and package box

A cardboard pasting and manufacturing method technology, which is applied in carton/carton manufacturing machinery, packaging, transportation and packaging, etc., can solve the problems of heat resistance limitation, harsh process, damage and acceptance of goods, etc., and achieve the effect of high pasting strength

Inactive Publication Date: 2007-06-13
天津三共包装制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, hot melt adhesives also have several disadvantages
First, hot melt adhesives have heat resistance limitations
Because its main component is a thermoplastic resin, it needs to be heated and melted to form a fluid state before use, so it has heat resistance restrictions
[0013] Second, although the hot-melt adhesive is easy to paste, the paste strength is relatively low
And these bonding materials protrude from the inside and outside of the box, which may damage the received items or injure the staff
In addition, water-based emulsion adhesives such as polysol with good adhesive strength are used as adhesives. However, the wetting and bonding process of aqueous emulsion paste takes a lot of time, and the process is very harsh. It is used in production lines or batches. Production has certain deficiencies

Method used

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  • Method for binding paper board, package box mfg. method and package box
  • Method for binding paper board, package box mfg. method and package box
  • Method for binding paper board, package box mfg. method and package box

Examples

Experimental program
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Effect test

Embodiment 1

[0043] 1 is a partially enlarged perspective view illustrating a cardboard pasting method according to a first embodiment of the present invention, and FIG. 2 is a flow chart illustrating the cardboard pasting method according to the first embodiment.

[0044] Referring to FIGS. 1 and 2 , a first cardboard 110 and a second cardboard 120 are provided, and an end portion of the second cardboard 120 is folded to form an adhesive sheet 125 .

[0045] The end of the first cardboard 110 is pasted and fixed with the adhesive sheet 125 , thereby combining the first cardboard 110 and the second cardboard 120 into one body.

[0046] The first adhesive I and the second adhesive II are coated side by side on the end of the first cardboard 110 . A hot-melt adhesive was used as the first adhesive I, and an aqueous emulsion adhesive polysol was used as the second adhesive II. The first adhesive 1 hot-melt adhesive is a solid adhesive, which has fluidity in the state of heating and melting, ...

Embodiment 2

[0051] 4 is a front view of a mother board illustrating a packaging box and its manufacturing method according to a second embodiment of the present invention, and FIGS. 5a and 5b are perspective views illustrating the packaging box and its manufacturing method according to the second embodiment.

[0052] Referring to FIGS. 4 to 5 a , the packaging box 200 includes a bottom plate 210 and side wall portions provided by a motherboard 201 in the shape of an expanded view. The motherboard 201 includes a bottom plate 210 , a first side wall portion 220 and a second side wall portion 230 . The bottom plate 210 is formed at the center of the motherboard 201 , and the four sides of the quadrangular shape are connected to the first and second side walls 220 , 230 along fold lines. That is, the first sidewall panels 220 are formed on two facing sides of the bottom panel 210 , and the second sidewall panels 230 are formed on the remaining two facing sides of the bottom panel 210 . As me...

Embodiment 3

[0074] Fig. 7 is a perspective view illustrating a packaging box machine manufacturing method according to a third embodiment of the present invention.

[0075] The packaging box and manufacturing method according to the third embodiment utilize the packaging box 200 according to the second embodiment, and the manufacturing method described in the second embodiment can be continued. For the convenience of description, the packaging box and its manufacturing method according to this embodiment refer to the drawings and descriptions of the previous embodiment.

[0076] Referring to FIG. 7 , the packing box 200 forms side walls with a first side wall panel 220 and a second side wall panel 230 . A divider 240 is provided inside the packaging box 200 to divide the inner space, and both ends of the divider 240 are pasted on the inner surface of the first side wall 220 . The divider 240 includes a divider center plate 242 in the center and divider sticking sheets 244 formed at both ...

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Abstract

This invention develops a simple sticking method for carboard keeping solid sticking strength for long and package boxes in this method and the manufacturing method for package boxes, in which, the sticking method and the manufacturing method characterize in using a first sticking agent with fine initial sticking force and a second sticking agent providing solid sticking strength at the same time, which can reduce poor adhesion appearing very often when assembling carboard boxes greatly.

Description

technical field [0001] The present invention relates to pasting, and in more detail, relates to a method for pasting cardboards such as cardboard (paper panels) conveniently and firmly, and a method for easily assembling packing boxes with mother boards using the pasting method. Background technique [0002] The packing box composed of cardboard is composed of a plurality of cardboards connected along the fold line, the cardboards are bent in turn, and pasted with an adhesive at their ends, so that the unfolded figure-shaped mother board is assembled into a packing box-shaped Box shape. In the past, staplers or adhesive tape were used to glue cardboard, but recently, many boxes are molded with adhesives due to the development of superior adhesives with strong adhesive properties. [0003] When making boxes made of cardboard recently, hot-melt adhesives (hot-meltadhesive) are widely used. Hot-melt adhesives are different from the solid adhesive components that are dissolved...

Claims

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Application Information

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IPC IPC(8): B31F5/04B31B17/60
Inventor 河玉子
Owner 天津三共包装制品有限公司
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