Positioning method and device for flexble printed circuit wiring plate relative cramping means

Abstract

The invention relates to a positioning method and a positioning apparatus for a transporting clamp for mounting a relative element of a flexible printed circuit wiring board. The subject of the invention is to provide a method and apparatus for positioning a plurality of flexible printed circuit wiring boards with a high precision when the flexible printed circuit wiring boards to be cut to corresponding sheets are fixed on the transporting clamp. The transporting clamp (22) is mounted on a cell of a mounting clamp (23) by a first position mechanism (24). The flexible printed circuit wiring board (FPC) (11) is held on a cell of the transporting clamp (22) mounted on the mounting clamp (23) in a tightly attached manner by a second positioning mechanism (26). Then the state of the FPC (11) is maintained, the transporting clamp (22) is removed from the mounting clamp (23), contact between the first position mechanism (24) and the second positioning mechanism (26) is released, the transporting clamp (22) holding the FPC (11) is transported to a component mounting process.

Description

technical field [0001] The present invention relates to a positioning method and a positioning device for a transport jig for mounting flexible printed circuit boards relative to components. In particular, the present invention relates to transporting a plurality of flexible printed circuit boards relative to each other in such a manner that they are held in close contact with good positional accuracy A positioning method and a positioning device for a fixture. Background technique [0002] Since thin film-like substrates such as flexible printed wiring boards are flexible, they cannot be directly set on a component mounting device to mount components. In this way, the sheet-like substrate before being punched into a corresponding product is fixed on a dedicated transport jig formed of a metal plate, a synthetic resin plate, etc., and components are mounted. However, there are cases where unsuitable products are included in the same sheet. If necessary, inspection of unsuit...

AI Technical Summary

Problems solved by technology

[0002] Since thin film-like substrates such as flexible printed circuit boards are flexible, they cannot be directly set on a component mounting device for component loading.

In this way, the sheet-like substrate before being punched into a corresponding product is fixed on a dedicated transport jig formed of a metal plate, a synthetic resin plate, etc., and components are mounted. However, there are cases where unsuitable products are included in the same sheet. situation, it is necessary to check the unsuitable part

[0003] In the inspection of unsuitable products, it takes 0.2 to 0.5 seconds for each product, and it takes a long time to inspect multiple products, resulting in large losses

In addition, since parts are not mounted on inappropriate parts, suitable products with parts loaded and unsuitable products without parts are mixed on the same sheet, resulting in a decrease in the efficiency of the parts mounting line

[0004] If a plurality of flexible printed circuit boards cut into corresponding pieces are fixed on a transport jig, the workability of component mounting will be improved. However, since the substrate is soft and easily deformed, the positional accuracy of the corresponding product cannot be ensured, and there is printing of solder paste. In the case of misalignment, short circuits, insufficient solder, or unconnected solder are prone to occur in small parts and narrow pitch parts

In this way, in the loading of small components and narrow pitch components, the yield rate is deteriorated, and it is desired to have a method of fixing a plurality of flexible printed circuit boards cut into corresponding sheets with good precision, and performing component loading.

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