Method of testing wires and apparatus for doing the same

Abstract

The invention provides an inspection device for detecting a break and short circuit in gate wires on a TFT substrate before forming a pixel part. The inspection device is used for inspecting a defect in the gate wires 2 on the TFT substrate 1 comprising a plurality of gate wires 2 which are inspecting objects, and a plurality of COM wires 3 capable of forming inter-wire capacitance between themselves and the gate wires 2, respectively. The inspection device includes a pulse generation part for impressing the gate wires 1 with a voltage, a capacitance detector 5 for detecting the inter-wire capacitance between the gate wires 2 and the COM wires 3, and capacitance connected between the COM wires 3 and the capacitance detector 5.

Description

technical field [0001] The invention relates to a wiring fault inspection method and a wiring fault inspection device. Background technique [0002] As shown in FIG. 7, in order to inspect the point defect and the line defect of the TFT substrate 1000, by connecting the measuring probes 1003, 1004 with the terminal portions of the drain wiring 1001 and the gate wiring 1002 formed on the TFT substrate (drain terminal 1001A, gate terminal 1002A) to connect the TFT substrate 1000 to an unshown tester (the tester includes a capacitance detector and a control device and constitutes a tester). In this state, a predetermined voltage is applied from the tester to the TFT substrate 1000 to write and read charges to and from the pixel capacitance formed on the TFT substrate 1000 . Thereby, a defective position is detected. This detection method is called pixel retention capacitance detection method. [0003] In addition, as shown in FIG. 8 , in the TFT substrate 2000 before the for...

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Problems solved by technology

[0004] However, in the conventional pixel storage capacitance detection method, since the storage capacitance of the pixel portion 1007 on the TFT substrate 1000 is detected to detect point defects and line defects, there is a so-called inability to detect defects where the pixel portion 1007 is not formed. The problem of disconnection of the gate wiring 1002 in the state

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