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Capacitance microphone and its making method

A capacitive microphone and the technology of its manufacturing method, which are applied in the field of microphones, can solve the problems of poor low-frequency performance of the microphone, distortion and deformation of the stress gradient tortuous beam, etc.

Active Publication Date: 2012-05-23
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the hollow part of the meander beam spring itself will cause poor low-frequency performance of the microphone, and the stress gradient of the material will cause the meander beam to twist and deform

Method used

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  • Capacitance microphone and its making method
  • Capacitance microphone and its making method
  • Capacitance microphone and its making method

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Embodiment Construction

[0053] In order to have a further understanding of the purpose, structure, features and functions of the present invention, the detailed description is as follows in conjunction with the embodiments. The above descriptions about the contents of the present invention and the following descriptions of the embodiments are used to demonstrate and explain the principles of the present invention, and provide further explanations for the claims of the present invention.

[0054] see figure 1 , is a cross-sectional structural view of the capacitive microphone of the present invention, which mainly includes a substrate 102 . The substrate 102 can be a silicon wafer and has a cavity 104 . Such as Figure 2AAs shown, the cavity 1041 in the shape of a vertical circular hole can be formed by using an Inductive Couple Plasma (ICP) dry etching method. Such as Figure 2B As shown, a cavity 1042 in the shape of a beveled square hole can be formed by using an anisotropic silicon wet etching...

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Abstract

This invention relates to one capacitor microphone and its process method, which comprises the following steps: forming one back board on base board with at least one hollow chamber with multiple holes and then forming sensor board on back board with one vibration space between back board and sensor board; the vibration space and hollow chamber are connected through each holes; the sensor board and back board have one first distance and one second distance less than first one to form different on sensor board by use of water steam or other liquid and back board to generate surface sticky situations.

Description

technical field [0001] The invention relates to a microphone, in particular to a condenser microphone and a manufacturing method thereof. Background technique [0002] Miniature condenser microphones are mostly made of thin-film technology, and the residual stress on the thin film severely limits the sensitivity of the microphone. Using a single-ended support method can effectively release the residual stress, but the microphone uses a fixed structure around it in operation, so an additional fixed structure is required design. [0003] Please refer to US Patent No. 6,535,460. In this patent, the backplane is located on the top of the structure, and the support structure is used to contact the polysilicon sensing plate. The backplane material must be non-conductive, and a layer of conductive material is required to form the upper electrode. The backplane material and the sacrificial layer material must have extremely high etching selectivity. The backplane must control its o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R31/00
Inventor 陈振颐
Owner IND TECH RES INST