Thin film material and method of manufacturing the same

A thin-film material and thin-film layer technology, applied in the fields of polycrystalline material growth, chemical instruments and methods, cable/conductor manufacturing, etc., can solve problems such as insufficient improvement, and achieve the effects of excellent surface smoothness and excellent in-plane orientation.

Inactive Publication Date: 2011-10-19
SUMITOMO ELECTRIC IND LTD +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is still a problem that the properties of the thus formed single crystal thin film layer (for example, if the formed single crystal thin film layer is a superconducting layer, properties such as the critical current density of the superconducting layer) cannot be sufficiently improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin film material and method of manufacturing the same
  • Thin film material and method of manufacturing the same
  • Thin film material and method of manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0038] refer to figure 1 and 2, describe the first embodiment of the superconducting wire rod of the present invention.

[0039] Such as figure 1 As shown, a superconducting wire 1 is composed of a substrate 2 , an intermediate layer 3 and a superconducting layer 4 . The substrate 2 is strip-shaped. The upper surface of the intermediate layer 3 is the polished surface, that is, the polished surface 10 . Therefore, superconducting layer 4 is formed on the upper surface (polished surface 10 ) of intermediate layer 3 having excellent surface smoothness, and thus the surface smoothness and in-plane orientation of superconducting layer 4 are improved. Therefore, superconducting wire 1 exhibiting excellent superconducting properties (critical current value and critical current density) can be obtained.

[0040] Referring then to Figure 2, the fabrication figure 1 The method of superconducting wire 1 is shown. According to manufacture figure 1 In the method of the supercon...

no. 2 approach

[0053] refer to Figure 5 , to describe the second embodiment of the superconducting wire rod of the present invention.

[0054] Such as Figure 5 As shown, the structure of the superconducting wire 1 is basically the same as figure 1 The superconducting wire 1 shown is similar, except that the upper surface of the substrate 2 is a ground surface 20 that is planarized by grinding. Also in this way, it is possible to provide the same figure 1 A similar effect is shown for the superconducting wire. In addition, since the upper surface of the substrate 2 is also flattened, the in-plane orientation of the superconducting layer 4 formed at the highest level can be further improved. Therefore, the critical current value and critical current density of the superconducting layer 4 can be further increased.

[0055] Referring to Figure 6, the fabrication Figure 5 The method of superconducting wire shown.

[0056] According to the method of manufacturing a superconducting wire...

no. 3 approach

[0060] refer to Figure 7 , the third embodiment of the superconducting wire rod of the present invention is described.

[0061] Figure 7 The structure of the shown superconducting wire 1 is basically the same as image 3 The superconducting wire rod shown is similar, except that the surface to be ground 10 is formed on the upper surface of the lower intermediate layer 3a in the intermediate layer 3 instead of the upper surface of the upper intermediate layer 3b in the intermediate layer 3, and the ground The upper surface of the substrate 2 is used to form the polished surface 20 . The superconducting wire rod 1 constituted in the above manner can also be provided with image 3 A similar effect is shown for the superconducting wire 1 . In addition, since the upper surface of the substrate 2 is also the flattened surface 20 to be polished, the flatness of the upper surface of the intermediate layer 3 can be further improved. Therefore, the in-plane orientation of superco...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
surface roughnessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

A thin film material which can improve characteristics of a film formed on a board, and manufacturing method thereof are provided. A superconducting wire rod (1) is provided with a board (2), one or more intermediate thin film layers (intermediate layers (3)) formed on the board, and a single crystalline thin film layer (superconducting layer (4)) formed on the intermediate thin film layer (intermediate layer (3)). At least in one of the intermediate thin film layers (intermediate layers (3)), an upper surface (plane (10) to be polished) which faces the single crystalline thin film layer (superconducting layer (4)) is polished.

Description

technical field [0001] The present invention relates to thin film materials and methods of making the thin film materials. More specifically, the present invention relates to a thin film material having a single crystal thin film layer excellent in crystallinity, and a method for producing the thin film material. Background technique [0002] Conventional thin film materials are known, such as superconducting thin film wires having a superconducting layer as an example of a single crystal thin film layer formed directly on a substrate (see, for example, JP-A-6-31604 (Patent Document 1), 6-68727 (Patent Document 2) and 6-68728 (Patent Document 3)), and a superconducting thin film wire having an intermediate thin film layer and a superconducting layer formed on a substrate (see, for example, "Development of High- Temperature Superconducting Thin Film Tape Using the ISD Method", SEI Technical Review, September 1999, Vol. 155, pp. 131-135 (Non-Patent Document 1)). [0003] Wit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/22C23C14/08H01B12/06H01B13/00
CPCC23C14/024C23C14/028C30B29/22H10N60/0632H01L21/20
Inventor 母仓修司大松一也
Owner SUMITOMO ELECTRIC IND LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap