Apparatus for heat dissipation and dissipation fluid therein
a technology of heat dissipation fluid and apparatus, which is applied in the direction of indirect heat exchangers, lighting and heating apparatus, etc., can solve the problems of reducing the heat transfer efficiency of the heat pipe, the drawbacks of these kinds of heat pipes still need to be overcome, and the flow-blocking effect of the induced bubbles
Inactive Publication Date: 2005-02-03
CHEN CHEI CHIANG
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Benefits of technology
"The present invention provides an apparatus and a fluid for heat dissipation that can reduce the flow-blockage effect of induced bubbles and increase the efficiency of heat transfer by the assistance of fluent flowing of tiny nanoparticles in a closed or sealed container. The nanoparticles can flow fluently inside a sealed heat pipe with capillaries within, and can even burst or disturb part of the induced bubbles through collision, thereby further reducing the number of induced bubbles. The sealed containers can be any conventional sealed or closed containers, such as heat pipes with capillaries within. The fluid of the present invention contains nanoparticles and conventional heat dissipating solvents, and the concentration of the nanoparticles can range from 0.001% to 10%. The nanoparticles can be metal nanoparticles or metal oxide nanoparticles, such as gold, silver, copper, or iron oxide nanoparticles. The diameter of the nanoparticles can be any length that they can flow fluently and won't be blockade by the induced bubbles. The dissipation fluid can also include other additives to increase thermal efficiency or functions of the fluid. The sealed container can be any conventional container, such as a heat pipe, and the position of the heat source can be on any end of the container or on the center part of the container. The technical effects of the present invention include reducing the flow-blockage effect of induced bubbles, increasing the efficiency of heat transfer, and improving heat dissipation in a closed or sealed container."
Problems solved by technology
If the heat generates by the electronic devices or the surrounding environments cannot be dissipated effectively, most of the electronic devices will function abnormally.
However, some drawbacks of these kinds of heat pipes are still need to be overcome with.
These aggregated bubbles will increase the thermal resistance to heat dissipation and also reduce the heat transfer efficiency of the heat pipe, these types of problems are amplified especially when the size of the bubbles are large.
Method used
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[0019] With reference to FIG. 1, there is shown an example of application of the heat pipes of the present invention. Two of the heat pipes 1 (or sealed containers) are located between and connects to a heat source 6 and a heat-dissipation fin 7. When one end of either heat pipe is subjected to heating, the fluid inside the heat pipe will be evaporated and transfers into vapour or gas. The evaporated gas or vapour further flow to the other end of the heat pipe and condense on the inside surface of the heat pipe 1 to dissipate heat carried from the evaporating end close to the heat source 6. The condensed liquid then flow back to the evaporated end (i.e. the end close to the heat source 6) through capillary effect. Hence, a cycle for heat transferring can be achieved inside the space or cavity of the heat pipe.
[0020] Please refer to FIG. 2. A cross-sectional view of a heat pipe is shown in FIG. 2. The cavity (or space) of the sealed container (i.e. heat pipe 1) is filled with a diss...
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An apparatus for heat dissipation is disclosed, which has a sealed container having a closed cavity; and a dissipation fluid comprising plural nanoparticles and a solvent. The dissipation fluid is set in and is able to flow through said sealed closed cavity of said container. A dissipation fluid used in the apparatus illustrated above is also disclosed.
Description
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an apparatus for heat dissipation and heat dissipation fluid thereof, more particularly, to an apparatus for heat dissipation by nanoparticles and heat dissipation fluid containing nanoparticles. [0003] 2. Description of Related Art [0004] It is known that electronic devices always generate some heats as they are operating in a standard condition. If the heat generates by the electronic devices or the surrounding environments cannot be dissipated effectively, most of the electronic devices will function abnormally. In most cases, at least a heat dissipating element is employed to keep the temperature of the electronic device well controlled and further prevent the possibility of unwanted interruptions owing to overheat of the electronic device. [0005] Currently, there are various types of techniques or heat dissipating elements for preventing overheat of electronic devices internally...
Claims
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IPC IPC(8): F28D15/02
CPCF28D15/02
InventorCHEN, CHEI-CHIANGCHIEN, HSIN-TANG
OwnerCHEN CHEI CHIANG