Structure of a uniform thermal conductive heat dissipation device

Abstract

An improved structure of a uniform thermal conductive heat dissipation device, having a thermal conductor and a plurality of heat pipes. The thermal conductor includes a convex body member, on which a plurality of parallel connecting parts is formed to allow the heat pipes embedded therein. Each of the heat pipes has a wick structure and a working fluid therein. Each heat pipe has a heat absorbing portion and a heat dissipation portion. The heat absorption portion is closely in contact with the thermal conductor. Thereby, each of the heat is subject to the same amount of heat to result in a uniform thermal conduction and dissipation effect.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates in general to an improved structure of a uniform thermal conductive heat dissipation device, and more particular, to a heat dissipation device of which the heat pipes are embedded in the thermal conductor to result in uniform thermal conduction and heat dissipation. [0002] In the old computer design, the operation speed of central processing unit (CPU) is so slow that an aluminum extrusion type or fin-type heat sink will be sufficient to dissipate the heat generated by the central processing unit. However, as the clock of central processing unit has exceeded 1 GHz or even reached 3 GHz, the heat generated by the central processing unit increases proportionally to the operation speed. However, due to the limited space within the housing, the conventional heat dissipation device can hardly provide effective heat dissipation. It has thus become a critical problem to be resolved in computer industry. [0003]FIG. 1 shows a c...

AI Technical Summary

Benefits of technology

[0005] The present invention provides an improved structure of a uniform thermal conductive heat dissipation device, of which heat pipes are embedded in a thermal conductor, and propagation path of heat has been so arranged that the distance between the heat source and each heat pipe is the same. Therefore, a uniform thermal conduction and heat dissipation effect is obtained.

Problems solved by technology

However, due to the limited space within the housing, the conventional heat dissipation device can hardly provide effective heat dissipation.

However, as the heat sink 30a cannot dissipate the heat away efficiently, such heat reflows back to the heat pipes 20a. As a result, the work fluid cannot be condensed quick enough to absorb further heat.

Therefore, the propagation path of heat is too long, and the heat pipes 20 cannot absorb the heat efficiently.

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