Method for fabricating a flash-preventing window ball grid array semiconductor package

Abstract

A flash-preventing window ball grid array semiconductor package, a method for fabricating the same, and a chip carrier used in the semiconductor package are provided. The chip carrier has a through hole and has a surface formed with a plurality of wire-bonding portions, ball-bonding portions and intended-exposing regions. A chip is mounted over the through hole and electrically connected to the wire-bonding portions by a plurality of bonding wires penetrating through the through hole. An encapsulation body encapsulates the chip and bonding wires. The intended-exposing regions serve as a narrow runner which is filled with an encapsulating material forming the encapsulation body, making the encapsulating material not flash over the ball-bonding portions. This allows a plurality of solder balls to be well bonded to the ball-bonding portions, thereby assuring the quality of electrical connection and the surface planarity of the semiconductor package.

Description

FIELD OF THE INVENTION [0001] The present invention relates to semiconductor packages and fabrication methods thereof, and more particularly, to a window ball grid array (WBGA) semiconductor package which can prevent the occurrence of resin flash and assure the quality of electrical connection, and a method for fabricating the semiconductor package, as well as a chip carrier used in the semiconductor package. BACKGROUND OF THE INVENTION [0002] A conventional window ball grid array (WBGA) semiconductor package uses a substrate having at least one through hole penetrating therethrough to allow a chip to be mounted on a surface of the substrate and over the through hole. A plurality of bonding wires go through the through hole and electrically connect the chip to the substrate. A plurality of solder balls are formed on a surface opposite to the chip-mounting surface of the substrate to electrically connect the chip to an external electronic device. This WBGA structure desirably shorten...

AI Technical Summary

Benefits of technology

"The present invention provides a flash-preventing WBGA semiconductor package, a method for fabricating the semiconductor package, and a chip carrier used in the semiconductor package. The semiconductor package has improved electrical connection quality, surface planarity, and a clean and satisfactory appearance. The method includes preparing a core layer with wire-bonding and ball-bonding portions, applying a solder mask layer with an opening for exposing the wire-bonding and ball-bonding portions, and forming bonding wires to electrically connect the chip to the wire-bonding portions. The chip carrier includes a core layer with wire-bonding and ball-bonding portions, and a conductive trace layer with wire-bonding portions and intended-exposing regions. The method and chip carrier can prevent resin flash and ensure the quality of the semiconductor package."

Problems solved by technology

Besides the above mentioned benefits, however, the WBGA package undesirably renders a yield issue.

This resin flash f not only damages the surface planarity and external appearance of the semiconductor package, but also possibly contaminates the ball-bonding regions 85 predefined on the second surface 82 of the substrate 80, making the solder balls 92 fail to be perfectly bonded to the substrate 80 and thus adversely affecting the quality of electrical connection of the semiconductor package.

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