Integrated circuit package with transparent encapsulant and method for making thereof

Abstract

IC package with transparent encapsulant and method for making thereof. The IC package includes a die pad including a pad bottom surface, a die disposed on the die pad and including an integrated circuit, a plurality of leads including a plurality of lead bottom surfaces, a plurality of conductive wires connecting the die and the plurality of leads, and an encapsulant material. The encapsulant material is transparent for visible wavelengths. The pad bottom surface is exposed without being covered by the encapsulant material, and the plurality of lead bottom surfaces each are exposed without being covered by the encapsulant material.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS [0001] This application claims priority to Malaysian Patent Application No. PI 20035051, filed Dec. 31, 2003, commonly assigned and incorporated by reference herein for all purposes. STATEMENT AS TO RIGHTS TO INVENTIONS MADE UNDER FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] NOT APPLICABLE REFERENCE TO A “SEQUENCE LISTING,” A TABLE, OR A COMPUTER PROGRAM LISTING APPENDIX SUBMITTED ON A COMPACT DISK. [0003] NOT APPLICABLE BACKGROUND OF THE INVENTION [0004] The present invention relates in general to integrated circuit (IC) packaging. More particularly, the invention provides an IC package with transparent encapsulant and a method for making thereof. Merely by way of example, the invention is described as it applies to a package in compliance with certain JEDEC standard, but it should be recognized that the invention has a broader range of applicability. [0005] Integrated circuits are usually packaged before being used in electronic syste...

AI Technical Summary

Benefits of technology

"The present invention provides an IC package with transparent encapsulant and a method for making it. The transparent encapsulant is reliable and durable, and the method can easily apply it. The use of stress-relief structures in a leadframe prevents or reduces delamination of the transparent encapsulant. The amount of transparent encapsulant used is reduced and the fabrication costs are lowered. The transparent IC packages have improved heat dissipation, smaller size, and / or lighter weight. The use of matrix arrays of packaging units allows for the use of a single mould for making packages of various sizes and shapes. The locking mechanisms prevent or reduce delamination of the transparent encapsulant."

Problems solved by technology

For example, the fabrication process for coating the ceramic sealant 16 on the lower side of the ceramic upper plate 15 is complex and costly.

Additionally, the desired sealant effect is difficult to achieve between the ceramic upper plate 15 and the window sealant 17.

If the window 10 is peeled off from the ceramic upper plate 15, the IC package 1 can be significantly damaged.

Such disassociation often leads to cracks and thereby damages the IC package.

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