Heat sink

Inactive Publication Date: 2005-09-15
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0022] The vapor chamber in the heat sink according to the invention is composed of a plurality of small vapor chambers and/or small sector

Problems solved by technology

However, this correspondingly produces more heat, and therefore relying on natural or forced convection is insufficient to remove heat.
However, the conventional heat sinks with fins have some problems that do affect the efficiency of heat removal.
For instance, a deficiency in temperature gradient due to the temperature difference between the fin surfaces and the heat sink airflow being only 5-10 degrees Celsius; the heat resistance problems due to the material and structure of the heat sink and low fin efficiency that is less than 70%.
These problems are the root causes for the conventional heat sinks not able to increase its' heat dissipation efficiency and further unable to remove the heat produced by electronic components sufficiently.
Nonetheless, the path for the working

Method used

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Example

[0025] Referring to FIG. 1, a heat sink 100 includes a main body 102 and a plurality of porous structures 110 inside the main body 102, wherein the main body 102 has a closed room 124 formed therein.

[0026] The main body 102 has a plurality of hollow protrusions 120 and a base 122 connecting to a heat source 118. The shape and / or size of the base 122 varies in accordance with the placement of the protrusions 120 and the shape of the heat source 118. Each protrusion 120 is hollow and has two ends; the end proximate the base 122 has an opening and the other end is closed. The protrusions 120 are in a shape of fin, column, lamella, cone, or lump; and in a form of curve, arch, slant, vertical, or any other form. The protrusions 120 and the base 122 of the main body 102 can be one-piece molded or jointed by soldering, engaging, embedding, adhering, or a combination of any of the methods listed thereof. Moreover, the closed room 124 can be divided into a plurality of vapor chambers 112 by...

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PUM

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Abstract

A heat sink including a main body and a plurality of porous structures is disclosed. The main body has a plurality of hollow fins and a base. The fins and the base form a closed room. The porous structures are set on the interior surfaces of different fins, and are connected to the base. Each porous structure defines a vapor chamber.

Description

BACKGROUND OF THE INVETION [0001] a) Field of the Invention [0002] The invention relates to a heat sink and, more particularly, to a heat sink that is able to dissipate heat quickly and efficiently. [0003] b) Description of the Prior Art [0004] With the advancement of electronic technology, the electronic components are miniaturized and densely packaged. However, this correspondingly produces more heat, and therefore relying on natural or forced convection is insufficient to remove heat. [0005] The conventional method of removing heat generated from electronic components is to conduct the heat from a heat source to a heat sink and then to dissipate the heat to the surroundings through natural or forced convection to the fins of the heat sink. However, the conventional heat sinks with fins have some problems that do affect the efficiency of heat removal. For instance, a deficiency in temperature gradient due to the temperature difference between the fin surfaces and the heat sink air...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCF28D15/0233F28F2215/06F28D15/046
Inventor LEE, YI-SHENG
Owner DELTA ELECTRONICS INC
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