Substrate treatment method and substrate treatment apparatus

a substrate treatment and substrate technology, applied in the direction of coatings, basic electric elements, chemical vapor deposition coatings, etc., can solve the problems of increasing the amount of resist solution going to waste, and reducing the total consumption of treatment solution. , the effect of reducing the number of pre-dispenses
US20050260333A1Inactive Publication Date: 2005-11-24TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
TOKYO ELECTRON LTD
Publication Date
2005-11-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention is a substrate treatment method in which a treatment by supplying a treatment solution from a nozzle to a substrate is successively performed for a plurality of substrates, which comprises the step of, during the performance of the successive treatments, performing between the treatments a plurality of pre-dispenses for different purposes of the treatment solution, wherein at least a recipe of the treatment solution to be pre-dispensed or a start condition of the pre-dispense is determined for each of the pre-dispenses. According to the present invention, the pre-dispense can be performed at a necessary and sufficient frequency to shorten the suspension time due to the pre-dispenses in the substrate treatment. This improves the throughput and reduces the number of pre-dispenses, resulting in reduced consumption of the treatment solution.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a substrate treatment method and a substrate treatment apparatus.

[0003] 2. Description of the Related Art

[0004] In fabrication processes of semiconductor devices, a resist coating treatment is performed in which a resist solution is supplied to, for example, a semiconductor wafer (hereafter referred to as a “wafer”) to form a resist film on the front face of the wafer.

[0005] This resist coating treatment is normally performed in a resist coating unit. The resist coating unit is provided with a nozzle for supplying a predetermined amount of the resist solution to the wafer. The nozzle is connected to a storage tank, which is a supply source of the resist solution, via a pipe. This pipe is provided with, for example, a pump for feeding the resist solution by pressure, a filter for removing impurities, an open / close valve for controlling discharge of the resist solution, and so on. T...

Claims

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