Substrate treatment method and substrate treatment apparatus

a substrate treatment and substrate technology, applied in the direction of coatings, basic electric elements, chemical vapor deposition coatings, etc., can solve the problems of increasing the amount of resist solution going to waste, and reducing the total consumption of treatment solution. , the effect of reducing the number of pre-dispenses

Inactive Publication Date: 2005-11-24
TOKYO ELECTRON LTD
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  • Abstract
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Benefits of technology

[0015] According to the present invention, the pre-dispense is performed only when the kind of the treatment solution is changed between the lots and not every change of lot as in the prior art, resulting in reduced number of pre-dispenses. Therefore, the total consumpt

Problems solved by technology

When left standing for a long time, the remaining resist solution dries or changes in quality.
During the pre-dispense, however, the treatment for wafers is suspended, and thus if its recipe is matched to that of the pre-dispense which needs to be performed most frequently, the throughput of

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  • Substrate treatment method and substrate treatment apparatus
  • Substrate treatment method and substrate treatment apparatus

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Embodiment Construction

[0035] Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is a perspective view of a coating and developing treatment system 1 capable of implementing a substrate treatment method according to the this embodiment, and FIG. 2 is a plane view schematically showing the configuration of the coating and developing treatment system 1.

[0036] As shown in FIG. 1 and FIG. 2, the coating and developing treatment system 1 has a configuration in which a cassette station 2 for carrying, for example, 25 wafers W in a unit of cassette from / to the outside to / from the coating and developing treatment system 1 and for carrying the wafers W to / from a cassette C, a processing station 3 composed of various kinds of processing units which are disposed in multi-tiers, for performing predetermined processing for the wafers W one by one in coating and developing processes, and an interface section 4 for delivering / receiving the wafers W to / from an aligner (not-shown) which...

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Abstract

The present invention is a substrate treatment method in which a treatment by supplying a treatment solution from a nozzle to a substrate is successively performed for a plurality of substrates, which comprises the step of, during the performance of the successive treatments, performing between the treatments a plurality of pre-dispenses for different purposes of the treatment solution, wherein at least a recipe of the treatment solution to be pre-dispensed or a start condition of the pre-dispense is determined for each of the pre-dispenses. According to the present invention, the pre-dispense can be performed at a necessary and sufficient frequency to shorten the suspension time due to the pre-dispenses in the substrate treatment. This improves the throughput and reduces the number of pre-dispenses, resulting in reduced consumption of the treatment solution.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a substrate treatment method and a substrate treatment apparatus. [0003] 2. Description of the Related Art [0004] In fabrication processes of semiconductor devices, a resist coating treatment is performed in which a resist solution is supplied to, for example, a semiconductor wafer (hereafter referred to as a “wafer”) to form a resist film on the front face of the wafer. [0005] This resist coating treatment is normally performed in a resist coating unit. The resist coating unit is provided with a nozzle for supplying a predetermined amount of the resist solution to the wafer. The nozzle is connected to a storage tank, which is a supply source of the resist solution, via a pipe. This pipe is provided with, for example, a pump for feeding the resist solution by pressure, a filter for removing impurities, an open / close valve for controlling discharge of the resist solution, and so on. T...

Claims

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Application Information

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IPC IPC(8): H01L21/00
CPCB05B15/0258H01L21/67276H01L21/67253H01L21/6715B05B15/555H01L21/027
Inventor MIYATA
Owner TOKYO ELECTRON LTD
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