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Self-cooled vertical electronic component

a technology of electronic components and current sources, applied in the direction of lighting and heating apparatus, domestic cooling apparatus, semiconductor/solid-state device details, etc., can solve the problems of not finding many practical applications, and the ability of autonomous current sources to provide a high curren

Inactive Publication Date: 2006-05-18
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0016] Generally, the present invention provides placing against a vertical monolithic circuit a Peltier cooler so that the cold surface of the cooler is in thermal contact with th

Problems solved by technology

Peltier coolers seem extremely attractive and exhibit at first sight many advantages with respect to conventional heat dissipation systems but have not found many practical applications except, possibly, to cool down devices under confined or dangerous atmosphere.
One of their disadvantages is that they require an autonomous current source capable of providing a high current.

Method used

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  • Self-cooled vertical electronic component
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Embodiment Construction

[0029] For clarity, the same elements have been designated with the same reference numerals in the different drawings and, further, as usual in the representation of integrated circuits, the various drawings are not drawn to scale.

[0030]FIG. 3 is a partial simplified cross-section view of a cooling system according to an embodiment of the present invention.

[0031] The rear surface of a monolithic, vertical, one-way electronic component 30 comprises a current output metallization 31.

[0032] Metallization 31 rests on a planar surface having a central conductive portion 40 in electric and thermal contact with a region 51 of a cell of a Peltier cooler 50. According to an aspect of the present invention, central portion 40 is a metal plate.

[0033] As also illustrated by the top view of FIG. 4, seen in plane A-A of FIG. 3, the Peltier cooler comprises a central P-type region 51, a ring-shaped N-type region 52 extending around central region 51, and a peripheral P-type region 54 extending...

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PUM

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Abstract

A self-cooled electronic component comprising a vertical monolithic circuit, in which the vertical monolithic circuit is electrically connected in series with a Peltier cooler so that the D.C. current flowing through the circuit supplies the cooler and in which the circuit and the cooler are placed against each other so that the cold surface of the cooler is in thermal contact with the circuit.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to the cooling of electronic components. More specifically, the present invention relates to the cooling of a vertical monolithic circuit capable of conducting a one-way current entering or coming out through its rear surface. [0003] 2. Discussion of the Related Art [0004] In monolithic electronic components or circuits, it is necessary to carry off the heat generated during operation. In particular, for semiconductor components with a junction, it is necessary to avoid changes in the temperature of the active junctions to guarantee stable operation characteristics. [0005]FIG. 1 is a simplified cross-section view of a vertical electronic component 1 made in monolithic form in a semiconductor substrate, or vertical monolithic circuit. Component 1 comprises a metallization 5 on a rear surface. A current flows through the component from one or several metallizations (not shown) formed on t...

Claims

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Application Information

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IPC IPC(8): F25B21/02F25D23/12
CPCH01L23/38H01L35/32H01L2924/0002H01L2924/00H10N10/17
Inventor MORAND, JEAN-LUC
Owner STMICROELECTRONICS SRL