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Methods to stop copper attach by alkaline etching agents such as ammonia and monoethanol amine (MEA)

a technology of alkaline etching agent and copper, which is applied in the direction of non-metal conductors, conductors, printed element electric connection formation, etc., can solve the problems of reduced bath life, ineffective bath, and inability to dissolve copper in the shadow® graphite bath or blackhole® carbon black bath, so as to prevent gel formation and stabilize or recover the corrosive composition

Inactive Publication Date: 2006-05-18
OMG ELECTRONICS CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The use of corrosion inhibitors effectively reduces copper dissolution and gel formation, prolonging the life of PCB manufacturing solutions and minimizing environmental impact by maintaining solution effectiveness and reducing waste treatment costs.

Problems solved by technology

A problem with the current manufacture of PCBs is that a Shadow® graphite bath (or a Blackhole® carbon black bath) dissolves copper from the circuit boards contacted by the bath.
Gel formation leads to a diminished bath life.
Cleaners and conditioners can cause similar problems because they also have alkaline etching agents (e.g. MEA) in them and are corrosive solutions.
The bath becomes ineffective, and then must be disposed of, when it is fouled with excess copper, and new baths are made.
This will not only increase manufacturing cost but also raise an environmental issue.
Solutions contaminated with copper must be treated before being disposed, and this will certainly incur waste treatment cost.
But such use of corrosion inhibitors does not prevent corrosion from happening inside a corrosive environment in the first place.
And this use does not prolong the life of a cleaner, a conditioner or a graphite bath.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

Preliminary Comparison Tests of Identical Corrosive Solutions with and without BTA

[0047] Five 1″×3″ (2.5 cm by 7.6 cm) copper laminate pieces were immersed into 250 ml of each of the following solutions with stirring: [0048] (1) 40 mN NH3 solution (conductivity=0.26 mS / cm); [0049] (2) 40 mN NH3 and NaCl solution (conductivity=1.6 mS / cm); [0050] (3) 40 mN NH3 and NaCl solution (conductivity=1.6 mS / cm)+1 g / L BTA (benzotriazole); [0051] (4) Shadow® 2, 4% graphite bath (control); [0052] (5) Shadow® 2, 4% graphite bath+1 g / L BTA

[0053] Results are compared in the following table which clearly shows the effect of BTA as a corrosion inhibitor.

SolutionsResults1Insoluble blue crystals formed on the copper surface ofthe board. Copper was attacked but the complex formedwas insoluble.2Copper was dissolved from the board and the solutionturned blue. But the next morning the solution becameless blue and a reddish brown precipitate (apparentlycopper) clung to the sides of the beaker.3Copper wa...

example 2

Determining The Effective Amount Of BTA

[0055] Different amounts of BTA were added to fresh Shadow® graphite baths. Five 1″×3″ (2.5 cm by 7.6 cm) copper laminate pieces were immersed into each of the baths for 3 hours, then they were removed and all the Shadow® solution on the laminate pieces was rubbed off. The pieces were etched in fresh persulfate (low BTA to high BTA order), then they were returned to their respective beakers and left overnight. The next morning the Cu was titrated. The results are shown in the following table:

BTA Concentration (ppm)Cu overnight (ppm)0552050814442317539320361100273200190

[0056] The results show that BTA has a favorable effect at and above the 1 ppm level and starts to be very effective at a 200 ppm level to reduce the copper attack by the ammonia in the Shadow® graphite solutions.

example 3

Study of Other Potential Corrosion Inhibitors

[0057] 500 ppm of the following chemicals were added to different fresh Shadow® graphite baths, 1″×3″ (3.8 cm by 7.6 cm) copper laminate pieces were immersed into each bar with stirring. After 24 hours, the Cu was titrated, and the results are shown in the following table.

Shadow ®Cu AmountGraphite BathsChemicals Added(ppm)Control ANo chemical added279Control BNo chemical added222CFormaldehyde280DSodium MBT (Na MBT)88EThiourea (626 ppm was added)82F3-amino-1,2,4-triazole200GQuadrol254HTolytriazole209

[0058] The results show that both Na MBT and Thiourea are very effective in the proportions used, and are capable of stopping or greatly reducing the copper attack by the ammonia in the Shadow® solutions. Tolyltriazole and 3-amino-1,2,4-triazole also showed some activity in the proportions used.

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Abstract

A corrosive composition, such as an alkaline aqueous carbon dispersion, a cleaner, a cleaner conditioner, or a conditioner, comprises a corrosion inhibitor, e.g., benzotriazole. The corrosion inhibitor is present in an amount effective to reduce or stop the dissolution of metal from a metallic surface, such as a printed circuit board, in contact with the composition. A method to reduce or stop the dissolution of metal from a metallic surface in contact with a corrosive composition, and a method to stabilize or recover a corrosive composition containing metal contaminants by adding an effective amount of a corrosion inhibitor to the corrosive composition.

Description

RELATED APPLICATIONS [0001] This is a divisional application of prior application Ser. No. 10 / 735,424, filed Dec. 12, 2003, now pending, which is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION [0002] The present invention generally relates to a composition comprising a corrosion inhibitor and a method for using the corrosion inhibitor to reduce or stop corrosion of metal from a metallic surface in a corrosive environment. One aspect of the present invention relates more particularly to such a composition and method to reduce or stop corrosion of copper from a circuit board in a solution containing etching agents, such as in a colloidal carbon dispersion, a cleaner, or a conditioner. [0003] In the manufacture of printed circuit boards (PCBs), especially multilayer PCBs, treatment chemicals that can etch copper from the copper surfaces of the circuit boards are employed in several steps. For example, aqueous carbon dispersions or electroless metal deposit...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01B1/12H01C17/28H05K3/38H05K3/42
CPCC23F11/149C23G1/20H01C17/28H05K3/383H05K3/424H05K3/427H05K2201/0323H05K2203/124
Inventor BERNARDS, ROGER FRANCISLAFAYETTE, BETH ANNPHAM, THAO
Owner OMG ELECTRONICS CHEM INC