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Microchannel heat exchanger fabricated by wire electro-discharge machining

a technology of electro-discharge machining and heat exchanger, which is applied in the direction of corrosion prevention, semiconductor device details, and semiconductor/solid-state device details, etc., can solve the problems of large pressure drop, high manufacturing cost, dirt clogging, and flow mal-distribution, and improve the efficiency of microchannel heat exchangers

Inactive Publication Date: 2006-07-20
HONEYWELL INT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, microchannels also have weaknesses, such as large pressure drop, high cost of manufacture, dirt clogging, and flow mal-distribution, especially for two-phase flows.
These weaknesses become more prevalent as the aspect ratio and the density of microchannels, and thus the efficiency, of microchannel heat exchangers increases.
These microchannel heat exchangers and microreactors would not provide optimal cooling because of the number of fins and low aspect ratio.

Method used

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  • Microchannel heat exchanger fabricated by wire electro-discharge machining
  • Microchannel heat exchanger fabricated by wire electro-discharge machining
  • Microchannel heat exchanger fabricated by wire electro-discharge machining

Examples

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example 1

[0054] An aluminum 6061 alloy panel was fabricated having 40 width of 0.0168 inches and a length of 1.00 inch. The microchannels were traight, parallel passages with bottom round radii of 0.008 to 0.009 inches, separated by 0.0079 inch thick fins, and having an aspect ratio of 27.

example 2

[0055] An aluminum 6061 alloy panel was fabricated having 40 microchannels or fins per inch. The microchannels had a depth of 0.45 inches, a width of 0.0179 inches and a length of 1.00 inch. The microchannels were straight, parallel passages with bottom round radii of 0.008 to 0.009 inches, separated by 0.0073 inch thick fins, and having an aspect ratio of 25.

example 3

[0056] An aluminum 6061 alloy panel was fabricated having 40 microchannels or fins per inch. The microchannels had a depth of 0.45 inches, a width of 0.0197 inches and a length of 1.00 inch. The microchannels were straight parallel passages with bottom round radii of 0.008 to 0.009 inches, separated by 0.0047 to 0.0054 inch thick fins, and having an aspect ratio of 23.

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Abstract

The present invention provides panels for a microchannel heat exchanger core wherein the panels may have greater than about 36 fins per inch of the panel. The microchannels of the panels may have an aspect ratio of at least about 10. Panels are also provided having microchannels and fins on one side of the panel or on opposite sides of the panel. Methods are also provided for machining the panels of the present invention.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates to heat exchangers and to electro-discharge machining processes. The present invention also relates to microchannel heat exchangers having a high aspect ratio and methods of making such heat exchangers. [0002] Heat transfer and fluid flow in the microchannels of microchannel heat exchangers have wide practical applications in highly specialized fields such as aerospace, bioengineering, microfabricated fluidic systems, and microelectronics. Lately, microchannel heat exchangers have also been used by the automotive air conditioning industry. The advantage of the microchannel heat exchanger lies in its high heat transfer coefficient and significant potential in decreasing the weight and size of heat exchangers. [0003] Compared with channels of normal size, microchannels have many heat transfer advantages. Since microchannels have an increased heat transfer surface area and a large surface-to-volume ratio, they provide a m...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F3/14
CPCF28F3/048F28F2260/02H01L21/4878H01L23/473Y10T29/4935Y10T29/49366Y10T29/49995Y10T29/49378H01L2924/0002H01L2924/00F28F19/00
Inventor GOLECKI, ILAN
Owner HONEYWELL INT INC
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