Cooling plate module

Abstract

A cooling plate module includes a cooling plate and a liquid driving module. The liquid driving module includes an accommodation chamber and a liquid driving unit used to driving cooling liquid. The liquid driving module includes a liquid inlet communicated to the accommodation chamber and a first liquid outlet is communicated to the bottom of the accommodation chamber. A cap encloses the first liquid outlet and a second liquid outlet is defined on the cap. The cooling plate is assembled with the cap to define a closed space therein and the first liquid outlet is corresponding to the heat-dissipating plates. Therefore, there is no duct connecting between the cooling plate and the liquid driving module, the stagnant problem caused by pressure difference can be prevented and the cool liquid can directly flush the heat-dissipating plates for enhancing heat dissipation efficiency.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a cooling plate module, and more particularly to a cooling plate module used for heat emitting device such as a CPU. [0003] 2. Description of Prior Art [0004] The computers are developed with more powerful function and computation speed. Beside performance issue, the product appearance, the construction and motherboard connection ways are also under extensive exploited. As downsize of form factor and increasing of processing speed, the heat dissipation for central processing unit (CPU) is also an important issue to solve. [0005]FIG. 1 shows a perspective view of a prior art liquid-cooling heat dissipation system 100a. As shown in this figure, the liquid-cooling heat dissipation system 100a comprises a heat dissipation stage 10a, a water outlet 101a and a water inlet 102a on both ends of the heat dissipation system stage 10a, respectively, a duct 103a connected between the water inlet...

AI Technical Summary

Benefits of technology

[0007] The present invention provides a cooling plate module wherein the cooling plate is integrally formed with the liquid driving module such that the layout of the cooling plate module can be minimized to reduce space.

[0008] The present invention further provides a cooling plate module, wherein there is no duct connecting between the cooling plate and the liquid driving module, the stagnant problem caused by pressure difference can be prevented and the cool liquid can directly flush the heat-dissipating plates for enhancing heat dissipation efficiency.

Problems solved by technology

Beside performance issue, the product appearance, the construction and motherboard connection ways are also under extensive exploited.

The liquid-cooling heat dissipation system 100a thus formed is bulky and hard to assemble.

This is adverse to the compact trend of computer.

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