Substrate processing apparatus

a processing apparatus and substrate technology, applied in the direction of photomechanical apparatus, instruments, photosensitive materials, etc., can solve the problem of not being able to make a resist pattern finer than

Inactive Publication Date: 2007-03-29
SOKUDO CO LTD
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  • Summary
  • Abstract
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Benefits of technology

[0014] It is an object of the invention to provide a substrate processing apparatus capable of pr

Problems solved by technology

With the conventional exposure devices, however, the line width of an exposure pattern is determined by the wavelength of the light source of an exposure device, thus making it impossible to make a resist pattern finer than that.
As a res

Method used

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Embodiment Construction

[0059] Substrate processing apparatuses according to the embodiment of the invention will be described with reference to the drawings.

[0060] A substrate as used in the description below includes a semiconductor substrate, a substrate for a liquid crystal display, a substrate for a plasma display, a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, and a substrate for a photomask.

[0061] Furthremore, the subsequent drawings are accompanied by the arrows that indicate X, Y, and Z directions perpendicular to one another for clarification of positions. The X and Y directions are perpendicular to each other in a horizontal plane, and the Z direction corresponds to the vertical direction. In each of the directions, the direction at which an arrow points is defined as + direction, and the opposite direction is defined as − direction. The rotation direction centered around the Z direction is defined as...

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Abstract

The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus for applying processing to substrates. [0003] 2. Description of the Background Art [0004] A substrate processing apparatus is used to apply a variety of processing to substrates such as semiconductor substrates, substrates for use in liquid crystal displays, plasma displays, optical disks, magnetic disks, magneto-optical disks, photomasks, and other substrates. Such a substrate processing apparatus typically applies a plurality of successive processing to a single substrate. [0005] The substrate processing apparatus as described in JP 2003-324139 A includes an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block as an external device separate from the substrate processing apparatus. [0006] The index...

Claims

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Application Information

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IPC IPC(8): G03D5/00
CPCG03F7/70991H01L21/67178H01L21/67173H01L21/67051
Inventor KANEYAMA, KOJIKANAOKA, MASASHIMIYAGI, TADASHISHIGEMORI, KAZUHITOYASUDA, SHUICHI
Owner SOKUDO CO LTD
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