Semiconductive coating and application process for shielded elastomeric electrical cable accessories

Abstract

A method is provided for manufacturing a semiconductive insulating shield for an electrical cable accessory. The method includes providing a substrate having a desired contour in relation to the electrical cable accessory. The substrate is then coated with an elastomeric semiconductive material to form a coated substrate. An elastomeric insulating dielectric material is then molded around the coated substrate, and the elastomeric semiconductive material and elastomeric insulating dielectric material are cured by applying heat and pressure sufficient to transfer the elastomeric semiconductive material to the elastomeric insulating dielectric material by chemical bonding.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims priority to application Ser. No. 10 / 339,054, filed Jan. 9, 2003 which is hereby incorporated by reference.FIELD OF THE INVENTION [0002] The present invention relates to shielded electrical cable accessories. More particularly, the present invention relates to a method for manufacturing a semiconductive shield useful for providing geometric electrical stress control and shielding to medium and high voltage electrical cable accessories. BACKGROUND OF THE INVENTION [0003] Termination or connection of high or medium voltage electrical cables in the field requires electrical shielding or stress control. Geometric electrical stress control and / or shielding of elastomeric cable accessories may be generally accomplished by one of the two following methods. [0004] In one method, an elastomeric semiconductive geometric stress control insert is pre-molded in one manufacturing operation. The insert is subsequently bonded to ...

AI Technical Summary

Benefits of technology

This approach enables a single molding operation with reduced material usage, eliminates the need for trimming and cleaning, and extends the shelf life of the product by allowing simultaneous transfer and cross-linking of the semiconductive coating, resulting in a more reliable and cost-effective solution with improved physical characteristics.

Problems solved by technology

The thicker pre-molded semiconductive components may impart undesirable physical characteristics to the final product.

The application of the secondary coating to irregular interior surfaces is very difficult to achieve effectively and is costly to apply.

Chemical cross-linking (chemical bonding) between an elastomeric semiconductive coating and an elastomeric insulating dielectric cannot be satisfactorily achieved unless the coating is subsequently cured or vulcanized by using heat and / or pressure during a secondary operation.

The shelf life of these components is limited in that the coatings are reactive systems containing catalysts.

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