Electronic component, module, module assembling method, module identification method and module environment setting method

Abstract

An electronic component capable of being assembled into a module in the form of a stack of a plurality of layers is provided. Terminals of terminal groups (31 to 36) are formed so as to have rotational symmetry of a predetermined fold-number or have rotational symmetry and symmetry with respect to the plane containing a symmetric axis line. The terminals (A0 to A7, RFCG) of common connection terminal groups (32, 36) have connecting portions formed on the both surfaces in a stacking direction. Among the terminals of individual connection terminal groups (31, 33), a specific terminal CS; KEY has a connection portion formed at least on one of the both surfaces in the stacking direction while the remaining associated terminals NC; DMY have connection portions formed on the both surfaces in the stacking direction. When such electronic components (20) are stacked so as to be shifted from each other by the angle obtained by dividing 360 degrees by the predetermined fold-number or in addition in the inverted state, it is possible to assemble a module using the electronic components (20) having the same configuration.

Description

TECHNICAL FIELD [0001] The present invention relates to an electronic component, a module assembled by stacking a plurality of the electronic components, a method of assembling the module, a method of identifying the assembled module, and a method of setting an operation environment of the assembled module. BACKGROUND ART [0002]FIG. 23 is a perspective view showing a first conventional art module 1. In order to realize high-density packaging of large-scale integrated circuits (LSIs) 2, the module 1 is formed by stacking the LSIs 2. The LSI 2 is mounted on a tape carrier 3 to configure a tape carrier package (TCP) 4, and the TCPs 4 are stacked to form the module 1. This module 1 is configured so that the LSIs 2 can be identified on the basis of the configurations of the tape carriers 3. [0003] Each of the LSIs 2 has a chip-side selection terminal 5 for inputting information for selecting and specifying the LSI, and a chip-side general terminal 6 for inputting and outputting informati...

AI Technical Summary

Benefits of technology

[0067] According to the invention, it is possible to set operation environments in the semiconductor devices of a m

Problems solved by technology

There is no problem in the case of stacking different kinds of chips because the chips have different configurations originally, but, for example, in the case of realizing a large-capacity memory by stacking a large number of memory chips, it is necessary to produce the same number of

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