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Transferring die(s) from an intermediate surface to a substrate

a technology of transfer dies and substrates, applied in the direction of manufacturing tools, forging/pressing/hammering apparatus, solid-state devices, etc., can solve the problems the accuracy of pick and place techniques is limited, and the drawback of limiting the throughput volum

Inactive Publication Date: 2007-06-14
SYMBOL TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012] The present invention is directed to methods, systems, and apparatuses for producing one or more electronic devices, such as RFID tags, that each include o

Problems solved by technology

Pick and place techniques involve complex robotic components and control systems that handle only one die at a time.
This has a drawback of limiting throughput volume.
Furthermore, pick and place techniques have limited placement accuracy, and have a minimum die size requirement.

Method used

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  • Transferring die(s) from an intermediate surface to a substrate
  • Transferring die(s) from an intermediate surface to a substrate
  • Transferring die(s) from an intermediate surface to a substrate

Examples

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Embodiment Construction

1.0 Overview

[0034] The present invention provides improved processes and systems for assembling electronic devices, including RFID tags. The present invention provides improvements over previous processes. Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates. The present invention can transfer multiple dies simultaneously. Vision-based pick and place systems are limited as far as the size of dies that may be handled, such as being limited to dies larger than 600 square microns (μm2). The present invention is applicable to dies having an area of 100 μm2 and even smaller. Furthermore, yield is poor in conventional systems, where two or more dies may be accidentally picked up at a time, causing losses of additional dies. The present invention allows for improved yield values.

[0035] The present invention provides an advantage of simplicity. Conventional die transfer tape mechanisms may be used by the present invention. Furthermore...

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Abstract

Dies that are attached to a die plate can be transferred to a substrate. An actuator can be used to cause a die to be released from the die plate and to come into contact with the substrate. For example, the die may cover a corresponding hole in the die plate. The actuator can move a pin into the hole in the die plate, thereby pushing the die from the die plate. The actuator may be actuated by an electromagnetic stimulus. For instance, a solenoid having windings around a tubular core may provide the electromagnetic stimulus to the actuator. Current may be provided to the windings of the solenoid to generate the electromagnetic stimulus that actuates the actuator. The actuator may be provided in the tubular core of the solenoid.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] The following applications of common assignee are herein incorporated by reference in their entireties: [0002]“Method, System, and Apparatus for Transfer of Dies Using a Pin Plate,” Ser. No. 10 / 866,159, filed Jun. 14, 2004 (Atty. Dkt. No. 1689.0560000); [0003]“Method, System, and Apparatus for Transfer of Dies Using a Die Plate,” Ser. No. 10 / 866,253, filed Jun. 14, 2004 (Atty. Dkt. No. 1689.0550000); and [0004]“Transferring Die(s) From an Intermediate Surface to a Substrate,” Ser. No. 11 / 091,944, filed Mar. 29, 2005 (Atty. Dkt. No. 2319.0080000). BACKGROUND OF THE INVENTION [0005] 1. Field of the Invention [0006] The present invention relates generally to the assembly of electronic devices. More particularly, the present invention relates to the transfer of integrated circuit (IC) dies to surfaces in high volumes. [0007] 2. Related Art [0008] Pick and place techniques are often used to assemble electronic devices. Such techniques involv...

Claims

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Application Information

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IPC IPC(8): B21J7/16
CPCH01L21/67144H01L24/75H01L24/81H01L24/95H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/83192H01L2924/14H01L2224/05573H01L2224/05568H01L2924/00014H01L2924/00H01L2224/05599
Inventor ADDISON, DAVIDBANDY, WILLIAM R.EASTIN, DAVIDARNESON, MICHAEL R.
Owner SYMBOL TECH INC
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