Unlock instant, AI-driven research and patent intelligence for your innovation.

Cooling device for electronic apparatus

a technology for electronic devices and cooling devices, which is applied in the direction of electrical equipment, electrical apparatus, electrical apparatus contruction details, etc., can solve the problems of inadequate cooling, two fans, and cold air being brought from outside the device to the electronic space that may be damp, so as to improve the reliability of the device

Inactive Publication Date: 2007-10-18
ABB OY
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This solution improves cooling efficiency within the electronic space while reducing the risk of corrosion by utilizing a return channel to enhance airflow, ensuring effective cooling with reduced fan requirements and minimizing the introduction of damp air, thereby enhancing the reliability of the cooling system.

Problems solved by technology

A disadvantage with the solution mentioned above is that it requires two fans in order to ensure adequate cooling.
Another disadvantage is that cold air is brought from outside the device to the electronic space that may be damp.
Bringing such air to the electronic space increases significantly the risk of corrosion and the risk of malfunctions caused by corrosion.
However, what remains a problem is still the fact that the cold air flowing from outside the device may cause corrosion in the electronic space.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cooling device for electronic apparatus
  • Cooling device for electronic apparatus
  • Cooling device for electronic apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014]FIGS. 1 and 2 illustrate a first preferred embodiment of the invention. FIG. 1 shows a cooling element 1. It is assumed in the example case shown in the Figures that the cooling element is formed of parallel plate-like cooling fins, between which air is able to flow.

[0015] An electronic component 2 is connected to the surface of the cooling element 1, the number of the electronic components in the case shown in FIGS. 1 and 2 is two. The heat load generated by the electronic components is thus transferred through the cooling element to the flow of air flowing through the cooling element. In FIG. 1 reference numeral 3 indicates areas of a flow area of the cooling element that are located furthest from the electronic components. When air flows through the cooling element 1 some of the air flow that is discharged from the cooling element 1 is colder in the areas 3, which are located furthest from the electronic components 2.

[0016]FIG. 2 illustrates the cooling element 1 shown in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average.

Description

CROSS REFERENCE TO RELATED APPLICATION [0001] This application is a Divisional Application of Application Ser. No. 11 / 335,271, filed Jan. 20, 2006.FIELD OF THE INVENTION [0002] The present invention relates to a cooling device for an electronic apparatus that enables to provide simple and efficient cooling for an electronic component fastened to a cooling element and in an electronic space of the electronic apparatus. The invention also relates to a cooling method. DESCRIPTION OF THE PRIOR ART [0003] A solution is previously known, in which cooling is carried out in electronic apparatuses such that the power electronic component is fastened to a cooling element, through which an air flow is arranged by means of a fan. Thus the heat load received from the power electronic component of the cooling element is transferred through the cooling element to the air flowing out from the electronic apparatus. Since the electronic apparatus is also provided with an electronic space, which inclu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/20H05K
CPCH05K7/20154
Inventor KAURANEN, MATTISILVENNOINEN, MIKASARES, MIKA
Owner ABB OY