Transport module

Abstract

A front-opening wafer transport module has a container portion with transparent shell and a central support structure which includes a machine interface exposed at the bottom of the module and integral wafer support columns extending upwardly in the container portion for supporting wafers. Additionally, the side walls of the shell have recessed portions with engagement members that cooperate with engagement members on removable handles. The handles utilize detents to lock into place in the recesses on the side walls of the carrier. Attachment of the handles to the side walls is accomplished without breaks between the interior and exterior of the module and without separate fastners.

Description

[0001]This application is a Continuation of application Ser. No. 10 / 848,096, filed May 18, 2004, which will issue May 13, 2008, as U.S. Pat. No. 7,370,764, which is a Continuation-in-Part of application Ser. No. 09 / 476,546, filed Jan. 3, 2000, which is a Continuation of application Ser. No. 08 / 891,644, filed Jul. 11, 1997 issued as U.S. Pat. No. 6,010,008 which are hereby incorporated herein by reference in their entirety.BACKGROUND OF THE INVENTION[0002]This invention relates to carriers for semiconductor wafers and more particularly it relates to a closeable container for storing and transporting wafers.[0003]Sealable enclosures, generally termed transport modules, have been utilized in the semiconductor processing industry for a number of years for storing and transporting wafers between processing steps and / or between facilities. Semiconductor wafers are notoriously vulnerable to damage from contaminants such as particles. Extraordinary measures are taken to eliminate contaminan...

AI Technical Summary

Benefits of technology

[0014]A feature and advantage of the invention is that there are no stacking of tolerances among parts relative to the machine interface level and the levels of the wafers on the wafer shelves. Where multiple components define the machine interface level and the wafer levels, each part has a separate manufacturing tolerance and when such components are assembled into the module the tolerances are cumulative. This translates into a higher rejection of individual parts and / or a higher rejection level of assembled modules. The instant invention utilizes a single integral component for the machine interface and the wafer support members.

[0015]Another advantage and feature of the invention is that a non-interrupted path-to-ground extends from each wafer support shelf to the machine interface.

[0016]Another object and advantage of the invention is that the central support structure which holds the wafers is assembled into the shell through a lower opening and is secured in place by a rotation of the central support structure with respect to the shell. No metallic fasteners are used.

[0017]Additionally, the central support structure engages and locks at the top of the shell by way of a top portion with a collar that extends into an aperture in the top of the shell and robotic lifting flange that slidably engages the top portion of the central support structure and also thereby non-rotatably locks the support structure to the shell. Again, no metallic fasteners or components are used.

[0018]Another object and advantage of the invention is that the breaks or openings in the module between the interior and exterior are sealed such as by elastomeric seals. The breaks or openings other than at the front door are circular in shape and are sealed such as by O-rings.

[0019]Anther object and advantage of the invention is that handles may be easily added and removed to the module without utilizing metallic fasteners or other separate fasteners and without breaks or openings in the solid side walls.

Problems solved by technology

Semiconductor wafers are notoriously vulnerable to damage from contaminants such as particles.

Electrostatic discharges can damage or ruin semiconductor wafers.

Due to inconsistencies in molding plastic parts assembly of such plastic parts lead to inconsistencies, such as open cracks between parts and the stacking of the tolerances of each individual part leading to undesirable variations in critical dimensions.

This can lead to difficulty in producing modules with acceptable tolerances between the wafer planes and the equipment interface.

Additionally, the use at any location in the pod of metallic fasteners or other metal parts are highly undesirable in semiconductor wafer carriers or containers.

Metallic parts generate highly damaging particulates when rubbed or scrapped.

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