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Thermal device for heat exchange

a heat exchange device and thermal device technology, applied in the direction of heat exchange apparatus, stationary tubular conduit assembly, stationary plate conduit assembly, etc., can solve the problem that the performance of devices can also be affected

Inactive Publication Date: 2009-03-05
KERBER TOM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The device's performance can also be affected by the addition of fins or corrugations that increases surface area and may and induce flow turbulence.

Method used

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  • Thermal device for heat exchange
  • Thermal device for heat exchange
  • Thermal device for heat exchange

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Experimental program
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Embodiment Construction

[0030]The following description is provided, alongside all chapters of the present invention, so as to enable any person skilled in the art to make use of said invention and sets forth the best modes contemplated by the inventor of carrying out this invention. Various modifications, however, is adapted to remain apparent to those skilled in the art, since the generic principles of the present invention have been defined specifically to provide a thermal device for heat exchange between a substance in solid state and a substance in liquid or gaseous state.

[0031]Reference is now made to FIG. 1, in accordance with the invention a thermal device 10 for heat exchange between a substance in solid state and a substance in liquid or gaseous state comprises a housing 12 having inlet and outlet ports 14 and 16, respectively, for inflowing and outflowing a heat transfer agent.

[0032]Reference is now made to FIG. 2, the housing 12 is formed by two heat conducting plates 20 disposed at a definite...

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Abstract

A thermal device for heat exchange between a substance in solid state and a substance in liquid state comprising a housing formed by two heat conducting plates disposed in parallel wherein wire-made grid-like 3-dimensional bracing is disposed between said plates and adapted to provide turbulent flow of said substance in liquid state; wires of said bracing are mechanically connected together and to said plates. A thermal device for heat exchange between a substance in solid state and a substance in gaseous state. A heat pipe container having a working fluid enclosed therein, said container formed by two heat conducting plates disposed in parallel against each other and sealed along their perimeter; said container having a capillary microchannel system for reversible fluid-gas circulation, wherein said capillary microchannel system is formed by wire-made grid-like 3-dimensional bracing disposed between said plates; wires of said bracing are mechanically connected together and to said plates.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application is a non-provisional patent application claiming benefit under 35 U.S.C. §119(e) of U.S. Provisional Application No. 60 / 935,736, filed Aug. 29, 2007, the entire contents of which are hereby expressly incorporated by reference into this disclosure as if set forth fully herein.FIELD OF THE INVENTION[0002]The present invention pertains generally to heating and / or cooling thermal devices and refers more particularly to compact plate-shaped heat devices.BACKGROUND OF THE INVENTION[0003]Delivering heat to any physical body by means of fluid or gaseous thermal transfer agents or extracting heat from this body in the same way is implemented by a thermal transfer device. This device is adapted to bring about a thermal contact between a heated / cooled body and a thermal transfer agent. Commonly this device is made of heat conducting metal. The effectiveness of the heat transfer depends on many variables including type and thickness o...

Claims

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Application Information

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IPC IPC(8): F28D15/00F28D7/00
CPCF28D9/0062F28F13/003F28F3/022F28D15/0233
Inventor KERBER, TOM
Owner KERBER TOM