Heat dissipating device and heat conduction structure thereof

Abstract

The heat conduction structure includes a first heat conduction plate, a second heat conduction plate and at least one heat pipes. The second heat conduction plate is positioned below the first heat conduction plate. A pair of walls extends from two opposite edges of the second heat conduction plate. The walls connect to a bottom surface of the first heat conduction plate. A receiving space is defined between the first heat conduction plate and the second heat conduction plate. At least one heat pipe is arranged in the receiving space and sandwiched between the first heat conduction plate and the second heat conduction plate. Each heat pipe has a heat absorbing section and a plurality of heat emitting sections extending from each heat absorbing section. A plurality of heat dissipating passages is defined between the at least one heat pipe and the walls. The heat emitting sections are partially positioned in the heat dissipating passages. The heat conduction structure can combine with a heat dissipating body and a fan to a heat dissipating device.

Description

BACKGROUND[0001]The present invention relates to a heat conduction structure, especially to a heat dissipating device with heat dissipating passages and the heat conduction structure thereof.[0002]Generally, a heat dissipating device is attached to a heat generating elements with direct contact, and a contact surface of the heat dissipating device is always made of metal with good thermal conductivity. Heat can be rapidly conducted from a heat generating element to the fins of the heat dissipating device.[0003]Recently, with the development of the computer, the operating speed of the elements inside the computer is greatly improved, and the heat from per unit area is greatly enhanced accordingly. The metal for thermal conduction is less used due to its insufficient thermal efficiency.[0004]A heat pipe and a vapor chamber are developed afterwards. However, the heat pipe can only provide thermal conduction by a manner of linear contact. The vapor chamber can provide thermal conduction...

AI Technical Summary

Benefits of technology

[0010]The present invention relates to a heat dissipating device. At least one heat pipe is disposed in the receiving space and sandwiched between the first heat conduction plate and the second heat conduction plate. The number of the at least one heat pipe can be configured to increase or reduce depending on the heat area size of the heat generating element. A best heat dissipating efficiency of the heat dissipating device can be achieved.

[0011]The present invention also relates to a heat dissipating device. The heat emitting sections are disposed in the heat dissipating passages. The airflow from the fan can flow through the heat dissipating passages to improve the heat dissipating efficiency of the heat dissipating device.

Problems solved by technology

Therefore, the heat conduction structure may dissipate heat by outer winds blowing to the heat emitting sections.

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