Wafer Container with Integrated Wafer Restraint Module

Abstract

A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which for importing and exporting said plurality of wafers, and a door with an outer surface and an inner surface, which is joined with opening of the container body with its inner surface for protecting the plurality of wafers in the container body, the characteristic in that: a recess is integrated with the inner surface of the door for separating the inner surface into two platforms, a restraint module is formed respectively on each of two platforms, and each restraint module includes a base which is disposed with a plurality of notches arranged at interval for contacting said plurality of wafers.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present field of the invention is related to a wafer container, and more particularly, to a wafer container with wafer restraint module integrated with two platforms on two sides of the recess of the inner surface of the door, with the design of which, not only can wafers settle in the recess of the door for decreasing the size of wafer container, but the wafer restraint component can also firmly sustain the wafers to prevent wafers from moving during the transferring process.[0003]2. Description of the Prior Art[0004]The semiconductor wafers are transferred to different stations to apply the various processes in the required equipments. A sealed container is provided for automatic transfer to prevent the pollution from occurring during transferring process. FIG. 1 shows the views of wafer container of the conventional prior art. The wafer container is a front opening unified pod (FOUP) which includes a container bo...

AI Technical Summary

Benefits of technology

[0006]In wafer container of prior art, the design of wafer restraint component causes problems such as size of wafer container that cannot be decreased, tiny dust particles that cannot be easily cleaned, and slackening of wafer restraint module that occurs more easily. One objective of the present invention is thus to provide a door formed by integration. Each notch of the wafer restraint module on one platform on two sides of the recess disposed on the surface of the door can be correspondingly aligned with the notch of the wafer restraint module on the other platform for increasing the accuracy of contact between wafer and notch.

[0007]Another objective of the present invention is to provide a front opening unified pod (FOUP) with wafer restraint module, wherein the wafer restraint module is disposed on platforms on two sides of the recess of the inner surface of the door for the recess to effectively support wafers and for decreasing the size of the front opening unified pod (FOUP).

[0008]Still another objective of the present invention is to provide a front opening unified pod (FOUP) with wafer restraint module, wherein the wafer restraint module is disposed on platforms on two sides of the recess of the inner surface of the door for shortening the distance for wafer restraint module to sustain and home wafer, for the door to close smoothly, and for reducing particles generated during the homing process of the wafer.

[0009]Yet another objective of the present invention is to provide a front opening unified pod (FOUP) with wafer restraint module, wherein the wafer restraint module is disposed on platforms on two sides of the recess of the inner surface of the door for tiny dust particles generated due to friction between wafer restraint module and wafer to gather in corner of the recess and to be cleaned up more easily without removing the wafer restraint module during the process of cleaning the wafer container.

Problems solved by technology

In wafer container of prior art, the design of wafer restraint component causes problems such as size of wafer container that cannot be decreased, tiny dust particles that cannot be easily cleaned, and slackening of wafer restraint module that occurs more easily.

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