Thin substrate pitch measurement equipment

Abstract

The present invention provides an equipment for measuring the vertical distance or pitch between a plurality of thin substrates inside a container body, including an optical component to transmit a light beam to a thin substrate in the container body and receive light beam reflected from the thin substrate, a scanning device to drive the optical component to move along vertical direction of the thin substrates for measuring the vertical distance or pitch between the plurality of thin substrates in the container body, and a rotation base to carry and rotate the container body to a plurality of angles for the plurality of thin substrates inside the container body to be measured from different angular positions.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present field of the invention is related to a measurement equipment for measuring pitch between thin substrates, and more particularly, to a measurement equipment for measuring pitch between thin substrates placed in the interior of container body from a plurality of different angles or different positions with the container body being rotated.[0003]2. Description of the Prior Art[0004]The semiconductor wafers are transferred to different stations to apply the various processes in the required equipments. A sealed container is provided for automatic transfer to prevent the pollution from occurring during transferring process. FIG. 1 shows the view of wafer container of the conventional prior art. The wafer container is a front opening unified pod (FOUP) which includes a container body 10 and a door 20. The container body 10 is disposed with a plurality of slots 11 for horizontally supporting a plurality of wafers W...

AI Technical Summary

Benefits of technology

The present invention is a thin substrate pitch measurement equipment that can detect displacement of thin substrates in a container body to prevent damage to other thin substrates or slip-out of thin substrates when the door is opened. It can measure the vertical distance between thin substrates and alert the operator when the distance is not as expected to prevent machine arm from causing crack or damages to thin substrates during the process. The equipment includes an optical component, a scanning device, and a rotation base that can rotate the container body at least to a certain angle to measure the pitch between thin substrates from different positions or angles.

Problems solved by technology

The design of wafer displacement detection system of prior art cannot fulfill the need of front opening unified pod (FOUP) and only the displacement of wafers can be detected; moreover, the distance between wafers cannot be measured quantitatively, and the excessive sag or concavity of wafers cannot be detected either.

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