Liquid electrical interconnect and devices using same

Abstract

Various embodiments include interconnects for semiconductor structures that can include a first conductive structure, a second conductive structure and a non-hardening liquid conductive material in contact with the first and second structure. Other embodiments include semiconductor components and imager devices using the interconnects. Further embodiments include methods of forming a semiconductor structure and focusing methods for an imager device.

Description

FIELD OF THE INVENTION[0001]This invention pertains to liquid interconnect systems, and methods of forming conductive liquid interconnections between electrical nodes.BACKGROUND OF THE INVENTION[0002]In semiconductor manufacture, packaging is the final operation that transforms a semiconductor substrate into a functional semiconductor component. Typically, the semiconductor substrate is in the form of a semiconductor die. Packaging provides protection for the semiconductor substrate, a signal transmission system for the integrated circuits on the semiconductor substrate, and external connection points for the component. In response to the demand for smaller, lighter and thinner consumer products, new semiconductor components and new packaging methods are being developed.[0003]In fabricating a semiconductor component, it is sometimes necessary to provide interconnects which allow transmission of signals from a circuit side of a semiconductor substrate to the backside of the semicondu...

AI Technical Summary

Benefits of technology

"The patent text describes a new method for creating conductive connections between semiconductor devices using liquid interconnects. These interconnects can allow for the transmission of signals between different parts of the semiconductor device. The method can overcome issues with traditional methods such as fatigue and limited expansion coefficients. The patent also describes a new semiconductor component structure that includes a first substrate with integrated circuits and a second substrate for mounting the first substrate. The first substrate can have a variety of substrate contacts arranged in different configurations. The technical effects of this patent are improved performance and reliability of semiconductor devices and more efficient packaging methods."

Problems solved by technology

Further, with a fixed electrical connection between the substrates, such as a solder connection, the electrical connection can fatigue degrading the connection between the substrates.

Further, a fixed electrical connection can not accommodate large differences in the coefficients of thermal expansion (CTE) between the substrates.

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